IP Library Granted Patent US 8,084,833
Granted Patent B2
US 8,084,833 · App. 12/807,853 · Granted Dec 27, 2011

Semiconductor device

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Quick Facts
Patent No.
US 8,084,833
App. No.
12/807,853
Granted
Dec 27, 2011
Kind
B2
Abstract

Provided is a LOCOS offset MOS field-effect transistor in which a first lightly-doped N-type drain offset region with a LOCOS oxide film and a second lightly-doped N-type drain offset region without a LOCOS oxide film are formed in a drain-side offset region, and both the regions are covered with a gate electrode. Provision of the first lightly-doped N-type drain offset region mitigates an electric field applied to the first lightly-doped N-type drain offset region to increase a breakdown voltage. Provision of the second lightly-doped N-type drain offset region increases carriers within the second lightly-doped N-type drain offset region to obtain a high current drivability.

Claims (38)

1. A semiconductor device, comprising:

a semiconductor substrate of a first conductivity type;

a first well region of a first conductivity type formed in a surface of the semiconductor substrate;

a second well region of a second conductivity type formed in the surface of the semiconductor substrate and in contact with the first well region;

a heavily-doped source region of a second conductivity type formed on the first well region;

a lightly-doped source offset region of a second conductivity type formed on the first well region and in contact with the heavily-doped source region;

a channel formation region configured on the fist well region and next to the heavily-doped source region;

a heavily-doped drain region of a second conductivity type formed on the second well region;

a first lightly-doped drain offset region of a second conductivity type formed on the second well region so as to be spaced away from the lightly-doped source offset region by a length of the channel formation region;

a second lightly-doped drain offset region of a second conductivity type formed between the heavily-doped drain region and the first lightly-doped drain offset region and in contact with both of them;

a LOCOS oxide film formed in a surface portion of the semiconductor substrate, the LOCOS oxide film comprising a first LOCOS oxide region formed on the lightly-doped source offset region and a second LOCOS oxide region formed on the first lightly-doped drain offset region;

a gate oxide film formed on:

a part of the first LOCOS oxide region formed in contact with the channel formation region on a source side,

the channel formation region,

an entirety of the second LOCOS oxide region formed in contact with the channel formation region on a drain side, and

the second lightly-doped drain offset region;

a gate electrode formed on the gate oxide film;

a source electrode formed on the heavily-doped source region; and

a drain electrode formed on the heavily-doped drain region.

2. A semiconductor device, comprising:

a semiconductor substrate of a first conductivity type;

a first well region of a first conductivity type formed in a surface of the semiconductor substrate;

a second well region of a second conductivity type formed in the surface of the semiconductor substrate and in contact with the first well region;

a heavily-doped source region of a second conductivity type formed on the first well region;

a lightly-doped source offset region of a second conductivity type formed on the first well region and in contact with the heavily-doped source region;

a channel formation region configured on the fist well region and next to the heavily-doped source region;

a first lightly-doped drain offset region of a second conductivity type formed on the second well region so as to be spaced away from the lightly-doped source offset region by a length of the channel formation region;

a second drain offset region of a second conductivity type formed on the second well region and next to the first lightly-doped drain offset region;

a heavily-doped drain region of a second conductivity type formed on the second well region so as to be spaced away from the first well region by lengths of the lightly-doped first drain offset region and the second drain offset region;

a LOCOS oxide film formed in a surface portion of the semiconductor substrate, the LOCOS oxide film comprising a first LOCOS oxide region formed on the lightly-doped source offset region and a second LOCOS oxide region formed on the first lightly-doped drain offset region;

a gate oxide film which is formed on:

a part of the first LOCOS oxide region formed in contact with the channel formation region on a source side,

the channel formation region,

an entirety of the second LOCOS oxide region formed in contact with the channel formation region on a drain side, and

the second drain offset region;

a gate electrode formed on the gate oxide film;

a source electrode formed on the heavily-doped source region; and

a drain electrode formed on the heavily-doped drain region.

Assignments (3)
CHANGE OF NAME Recorded Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2016
From: SEIKO INSTRUMENTS INC.
To: SII SEMICONDUCTOR CORPORATION
Reel/Frame 038058/0892 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2010
From: KATO, SHINJIRO
To: SEIKO INSTRUMENTS INC.
Reel/Frame 025231/0933 →