Assembly of electronic components
View Patent ↗An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.
1. An electronic component assembly comprising:
a supporting structure;
an integrated circuit die with a plurality of contacts pads;
a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other; and,
wire bonds electrically connecting the contact pads to the conductors; wherein,
an intermediate portion of each of the wire bonds is adhered to the die attach film.
2. An electronic component assembly according to claim 1 wherein the PCB is a flexible PCB and the supporting structure is a liquid crystal polymer (LCP) molding.
3. An electronic component assembly according to claim 1 wherein the wire bonds are formed from lengths of wire with a gauge between 15 microns and 75 microns.
4. An electronic component assembly according to claim 3 wherein the gauge is about 25 microns.
5. An electronic component assembly according to claim 4 wherein the wire bonds attach to respective contact pads on the IC die and the wire bonds do not extend more than 150 microns above the contact pads of the IC die.
6. An electronic component assembly according to claim 5 wherein the line of wire bonds does not extend more than 50 microns above the contact pads of the IC die.
7. An electronic component assembly according to claim 1 wherein the contact pads are spaced from the corresponding conductors on the PCB by more than 1 mm.
8. An electronic component assembly according to claim 7 wherein the contact pads are between 2 mm and 3 mm from the corresponding conductors on the PCB.
9. An electronic component assembly according to claim 1 wherein the PCB is a flexible PCB mounted to a support structure together with the die such that the conductors are adjacent the contact pads on the die.
10. An electronic component assembly according to claim 9 wherein the support structure has a chip mounting area for supporting the die, the die having a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors.
11. An electronic component assembly according to claim 1 wherein the wire bonds is formed using aluminium wire.
12. An electronic component assembly according to claim 10 wherein the active surface has functional elements spaced less than 260 microns from the contacts pads of the die.
13. An electronic component assembly according to claim 1 wherein the die is an inkjet printhead IC and the functional elements are nozzles through which ink is ejected.
14. An electronic component assembly according to claim 13 wherein the printhead IC is configured to be mounted in a printer such that during use the nozzles are less than 100 microns from the paper path.