Electronic board, method of manufacturing the same, and electronic device
View Patent ↗An electronic board includes a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; a rearrangement wiring for the connection terminal disposed at a top side of the stress-relaxation layer; and a capacitor. The capacitor has a first electrode that is disposed between the substrate and the stress-relaxation layer, a second electrode that is disposed at the top side of the stress-relaxation layer, and a dielectric material that is disposed between the first electrode and the second electrode. The first electrode and/or the second electrode has a corrugated surface facing the dielectric material.
1. A method of manufacturing an electronic board, comprising:
forming a substrate on which is formed an electronic circuit having a connection terminal;
forming a stress-relaxation layer on a substrate;
forming a first electrode, the first electrode disposed between the substrate and the stress-relaxation layer;
forming a second electrode, the second electrode disposed at a top side of the stress-relaxation layer;
arranging a dielectric material layer on the substrate, the dielectric material disposed between the first electrode and the second electrode;
forming a corrugated surface on at least one of the stress-relaxation layer and the dielectric material layer, the corrugated surface being adjacent to the first electrode and/or the second electrode; and
forming rearrangement wiring for the connection terminal, the rearrangement wiring disposed at the top side of the stress-relaxation layer.
2. A method of manufacturing an electronic board according to claim 1 , wherein the dielectric material layer is the stress-relaxation layer.
3. A method of manufacturing an electronic board according to claim 1 , wherein formation of the corrugated surface is performed by photolithography.
4. A method of manufacturing an electronic board according to claim 1 , wherein formation of the corrugated surface is performed by etching.
5. A method of manufacturing an electronic board according to claim 1 , wherein formation of the corrugated surface is performed by a transfer method.
6. A method of manufacturing an electronic board, comprising:
forming a substrate on which is formed an electronic circuit having a connection terminal;
forming a first stress-relaxation layer on a substrate;
forming a second stress-relaxation layer on the first stress-relaxation layer;
forming a first electrode, the first electrode disposed between the first stress-relaxation layer and the second stress-relaxation layer;
forming a second electrode, the second electrode disposed at a top side of the second stress-relaxation layer;
arranging a dielectric material layer on the substrate, the dielectric material disposed between the first electrode and the second electrode; and
forming a corrugated surface on at least one of the second stress-relaxation layer and the dielectric material layer, the corrugated surface being adjacent to the first electrode and/or the second electrode.
7. A method of manufacturing an electronic board according to claim 6 , further comprising, forming a corrugated surface on the first stress-relaxation layer and the dielectric material layer, the corrugated surface being adjacent to the first electrode and/or the second electrode.
8. An electronic device characterized by being provided with the electronic board recited in claim 1 .