The invention relates to a method for masking a semiconductor substrate including the following steps: providing a planar semiconductor substrate having a first side and a second side lying opposite thereto, applying a mask to at least one of the sides, an extrusion printing method being used for applying the mask.
1. A method for masking a semiconductor substrate, the method comprising the following steps:
providing a planar semiconductor substrate having a first side and a second side lying opposite thereto; and
applying a mask to at least one of the first side and the second side, wherein an extrusion printing method is used for applying the mask, said mask comprising at least two adjacent areas with different mask materials, wherein an etching paste is used as one of said different mask materials for etching a layer on the semiconductor substrate.
2. A method for masking a semiconductor substrate, the method comprising the following steps:
providing a planar semiconductor substrate having a first side and a second side lying opposite thereto; and
applying a mask to at least one of the first side and the second side, wherein an extrusion printing method is used for applying the mask, said mask comprising at least two adjacent areas with different mask materials, wherein a doping step is used after the application of the mask, one of said different mask materials at least partly absorbing a dopant beam.
3. A method for masking a semiconductor substrate, the method comprising the following steps:
providing a planar semiconductor substrate having a first side and a second side lying opposite thereto; and
applying a mask to at least one of the first side and the second side, wherein an extrusion printing method is used for applying the mask, said mask comprising at least two adjacent areas with different mask materials, wherein an ion implantation step is used after the application of the mask, wherein first mask materials at least partly absorb a dopant beam.