IP Library Granted Patent US 7,935,755
Granted Patent B2
US 7,935,755 · App. 12/815,918 · Granted May 3, 2011

Aqueous polymer dispersions and products from those dispersions

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,935,755
App. No.
12/815,918
Granted
May 3, 2011
Kind
B2
Abstract

A method for forming a heat sealable coating on a substrate, wherein the substrate is formed from at least one oriented polymer is shown. The method includes depositing an aqueous polymer dispersion on the substrate, wherein the aqueous polymer dispersion includes (A) at least one thermoplastic resin; (B) at least one dispersing agent; and (C) water; wherein the dispersion has a pH of less than 12, and drying the dispersion to form a first layer.

Claims (12)

1. A film layer comprising:

a substrate; and

a coating associated with said substrate; wherein the coating is derived from an aqueous dispersion comprising (A) at least one thermoplastic resin, wherein the thermoplastic resin comprises an interpolymer of ethylene with at least one comonomer selected from the group consisting of a C 4 -C 20 linear, branched or cyclic diene, vinyl acetate, and a compound represented by the formula H 2 C═CHR wherein R is a C 2 -C 20 linear, branched or cyclic alkyl group or a C 6 -C 20 aryl group; (B) at least one dispersing agent; and (C) water; wherein the dispersion had a pH in the range of 8 to 11.

2. The film layer of claim 1 , wherein the coating is heat sealable.

3. The film layer of claim 1 , wherein said substrate comprises a polymer selected from the group consisting of polyesters, polycarbonates, polyarylates, polyamides, polyimides, polyamide-imides, polyether-amides, polyetherimides, polyaryl ethers, polyarylether ketones, aliphatic polyketones, polyphenylene sulfide, polysulfones, polystyrenes and their derivatives, polyacrylates, polymethacrylates, cellulose derivatives, polyethylenes, polypropylene, other polyolefins, copolymers having a predominant olefin monomer, fluorinated polymers and copolymers, chlorinated polymers, polyacrylonitrile, polyvinylacetate, polyvinylalcohol, polyethers, ionomeric resins, elastomers, silicone resins, epoxy resins, and polyurethanes, miscible or immiscible polymer blends, and copolymers of any of the constituent monomers of any of the above-named polymers.

4. The film layer of claim 3 , wherein the substrate comprises at least one selected from the group consisting of polypropylene, polyamides, polyesters, polyethylene, and polystyrene.

5. The film layer of claim 1 , wherein the thermoplastic resin has a density between 0.85 and 0.90 g/cc.

6. The film layer of claim 2 , wherein the coating is characterized as having a heat seal initiation temperature of less than 80° C.

7. The film layer of claim 6 , wherein the coating is characterized as having a heat seal initiation temperature of less than 70° C.

8. An article comprising the film layer of claim 1 .

9. The film layer of claim 1 , wherein said film layer is biaxially oriented polypropylene.

10. The film layer of claim 1 , wherein said substrate is biaxially oriented polypropylene.

Assignments (1)
CHANGE OF NAME Recorded Mar 30, 2011
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 026047/0372 →