Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

1. A method of manufacturing a semiconductor device on a semiconductor wafer comprising:

a hollow tubular trench formed at a position to form a through-hole electrode of a silicon wafer;

an insulating member buried inside the trench and on an upper surface of the silicon wafer surrounded by the trench;

a conducting film formed on an upper surface of the insulating member;

a conducting member formed on the conducting film; and

an external connection electrode formed electrically connected to the conducting film via the conducting member,

the method comprising steps of:

thinning the semiconductor wafer from its back surface and exposing the insulating member buried inside the trench;

dissolving the insulating member inside and on an upper surface of the trench by wet etching; and

forming a silicon hole part reaching the conducting film by dropping a silicon piece of an inner surface of the trench.

2. The method of manufacturing a semiconductor device according to claim 1 further comprising the steps of:

forming an insulating film in an inner surface of the silicon hole part and on a whole surface of the back surface of the semiconductor wafer;

exposing the conducting film by removing the insulating film on a bottom part of the silicon hole part; and

forming a seed layer for electrolytic plating and an electrolytic plating film on the inner surface of the silicon hole part and a predetermined area of the back surface of the semiconductor wafer so as to form a through-hole electrode electrically connected to the external connection electrode.

3. The method of manufacturing a semiconductor device according to claim 1 ,

wherein the steps from exposing the insulating member to forming the silicon hole part are performed with the semiconductor wafer adhered to a holding member, and the semiconductor wafer is separated from the holding member after finishing manufacturing.

4. A method of manufacturing a semiconductor wafer comprising the steps of:

forming a hollow tubular trench at a position to form a through-hole electrode of a silicon wafer;

burying an insulating member inside the trench and on an upper surface of the silicon wafer surrounded by the trench;

forming a conducting film on an upper surface of the insulating member;

forming a conducting member on an upper surface of the conducting film;

forming an external connection electrode electrically connected to the conducting film via the conducting member;

thinning the silicon wafer from its back surface and exposing the insulating member buried inside the trench;

dissolving the insulating member inside and on an upper surface of the trench by wet etching;

forming a silicon hole part reaching the conducting film by dropping a silicon piece of an inner surface of the trench;

forming an insulating film in an inner surface of the silicon hole part and on a surface of the back surface of the silicon wafer;

exposing the conducting film by removing the insulating film only on a bottom part of the silicon hole part; and

forming a seed layer for electrolytic plating and an electrolytic plating film on the inner surface of the silicon hole part and a predetermined area of the back surface of the silicon wafer so as to form a through-hole electrode electrically connected to the external connection electrode.

5. A method of manufacturing a semiconductor wafer comprising the steps of:

forming a hollow tubular trench at a position to form a through-hole electrode of a silicon wafer;

burying an insulating member inside the trench and on an upper surface of the silicon wafer surrounded by the trench;

forming a conducting film on an upper surface of the insulating member;

forming a conducting member on an upper surface of the conducting film;

forming an I/O wiring, a power wiring, or a ground wiring in an LSI electrically connected to the conducting film via the conducting member;

thinning the silicon wafer from its back surface and exposing the insulating member buried inside the trench;

dissolving the insulating member inside and on an upper surface of the trench by wet etching;

forming a silicon hole part reaching the conducting film by dropping a silicon piece of an inner surface of the trench;

forming an insulating film in an inner surface of the silicon hole part and on a whole surface of the back surface of the silicon wafer;

exposing the conducting film by removing the insulating film only on a bottom part of the silicon hole part; and

forming a seed layer for electrolytic plating and an electrolytic plating film on the inner surface of the silicon hole part and a predetermined area of the back surface of the silicon wafer so as to form a through-hole electrode electrically connected to the external connection electrode.

6. The method of manufacturing a semiconductor device according to claim 2 comprising the steps of:

dicing the semiconductor wafer having the through-hole electrode formed therein into a size of each chip; and

forming a gold bump on the external connection electrode of each of the diced chips,

wherein, to stack a second chip having the gold bump on a first chip having the through-hole electrode, the gold bump of the second chip is pressed into the inside of through-hole electrode of the first chip and mechanically caulked so as to electrically connect between the stacked chips.