IP Library Granted Patent US 8,441,896
Granted Patent B2
US 8,441,896 · App. 12/824,080 · Granted May 14, 2013

Energy assisted magnetic recording head having laser integrated mounted to slider

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Quick Facts
Patent No.
US 8,441,896
App. No.
12/824,080
Granted
May 14, 2013
Kind
B2
Abstract

A method and system for providing energy assisted magnetic recording (EAMR) heads are described. The method and system include providing a substrate, at least one EAMR transducer, an overcoat layer and at least one laser. The substrate has a leading edge and a substrate trailing edge. The EAMR transducer(s) reside in a device layer and on the substrate trailing edge. The overcoat layer includes a plurality of contacts. The device layer is between the overcoat layer and the substrate trailing edge. The laser(s) provide energy to the EAMR transducer. The overcoat layer is between the substrate trailing edge and the laser(s). The laser(s) are electrically coupled to at least a first portion of the contacts. The contacts provide thermal connection through the overcoat layer and the device layer. At least a second portion of the contacts is electrically insulated from the substrate.

Claims (28)

1. An energy assisted magnetic recording (EAMR) head comprising:

a substrate including a leading edge and a substrate trailing edge;

at least one EAMR transducer residing in a device layer and on the substrate trailing edge;

an overcoat layer including a plurality of contacts, the device layer residing between the overcoat layer and the substrate trailing edge;

at least one laser for providing energy to the EAMR transducer, the overcoat layer residing between the substrate trailing edge and the at least one laser, the at least one laser being electrically coupled to at least a first portion of the plurality of contacts, the plurality of contacts providing thermal connection through the overcoat layer and through the device layer to the substrate, at least a second portion of the plurality of contact being electrically insulated from the substrate.

2. The EAMR head of claim 1 wherein the overcoat layer further includes at least one additional contact, the at least one laser being electrically insulated from the at least one additional contact.

3. The EAMR head of claim 1 wherein the at least one laser has a laser footprint on the overcoat layer, and wherein the plurality of contacts extends at least across the laser footprint in a first direction and are separated by a distance in a second direction, the distance being such that each of the plurality of electrical contacts is electrically isolated from any other electrical contact in the overcoat layer.

4. The EAMR head of claim 3 wherein the distance is a minimum separation such that each of the plurality of electrical contacts is electrically isolated from any other electrical contact in the overcoat layer.

5. The EAMR head of claim 1 further comprising:

a plurality of laser bond pads for electrically connecting the at least one laser with the plurality of contacts and mechanically coupling the at least one laser with the overcoat layer.

6. The EAMR head of claim 1 wherein each of the second portion of the plurality of contacts includes an insulating layer therein, the insulating layer allowing thermal connection through the device layer and electrical connection to a portion of the device layer.

7. The EAMR head of claim 1 further comprising:

a capping layer enclosing the at least one laser.

8. The EAMR head of claim 1 further comprising:

a heat spreader adjacent to a portion of the substrate, the heat spreader thermally connected with at least a third portion of the plurality of contacts.

9. The EAMR head of claim 8 wherein the EAMR head includes an air-bearing surface (ABS) and wherein a portion of the heat spreader occupies a portion of the ABS.

10. The EAMR head of claim 8 wherein the heat spreader includes a thermally conductive slab.

11. The EAMR head of claim 8 wherein the heat spreader includes a plurality of thermally conductive bars.

12. The EAMR head of claim 1 wherein the overcoat layer further includes:

an electrically insulating heat spreader thermally connected with the plurality of contacts and electrically insulating the plurality of contacts.

13. The EAMR head of claim 1 wherein the plurality of contacts includes at least one of Cu, Ag, and Au.

14. An energy assisted magnetic recording (EAMR) disk drive comprising:

a media for storing data; and

a slider including a substrate, a device layer, at least one EAMR transducer residing in the device layer, and an overcoat layer, the substrate including a leading edge and a substrate trailing edge, the device layer residing on the substrate trailing edge, the overcoat layer including a plurality of contacts, the device layer residing between the overcoat layer and the substrate trailing edge, the plurality of contacts providing thermal connection through the overcoat layer and through the device layer to the substrate; and

at least one laser for providing energy to the EAMR transducer, the overcoat layer residing between the substrate trailing edge and the at least one laser, the at least one laser being electrically coupled to at least a first portion of the plurality of contacts, at least a second portion of the plurality of contact being electrically insulated from the substrate.

15. The EAMR head of claim 8 wherein the third portion of the plurality of contacts provide thermal connection to an air-bearing surface including a portion of the substrate through the heat spreader.

16. The EAMR disk drive of claim 14 wherein the slider further includes:

a heat spreader adjacent to a portion of the substrate, the heat spreader thermally connected with at least a third portion of the plurality of contacts, the third portion of the plurality of contacts providing thermal connection to an air-bearing surface including a portion of the substrate through the head spreader.

Assignments (9)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038710 FRAME 0845 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL (FREMONT), LLC; WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0445 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2019
From: WESTERN DIGITAL (FREMONT), LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 050450/0582 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 045501/0158 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0755 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0675 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038710/0845 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2010
From: WANG, LEI; LEE, SHING; YAN, WENTAO
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 024752/0961 →