Thermal control of optical filter with local silicon frame
View Patent ↗Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.
1. A method, comprising:
forming two or more frames from a first wafer;
disposing a resistive thermal device on each of the two or more frames;
bonding the first wafer to a second wafer to form a bonded combination wafer; and
dicing the bonded combination wafer into two or more optical subassemblies of two or more optical filters.
2. The method of claim 1 , wherein the first wafer comprises a thermally conductive material and the second wafer comprises a wafer of etalons.
3. The method of claim 2 , wherein the thermally conductive material comprises silicon (Si), tungsten copper (WCu), or silicon carbide (SiC).
4. The method of claim 2 , wherein said forming comprises a dry etch process or a wet etch process, or combinations thereof, to define the two or more frames on the first wafer.
5. The method of claim 1 , further comprising bonding one of the optical filters onto a micro hot plate.
6. The method of claim 1 , further comprising disposing a heater on each of the two or more frames.
7. The method of claim 1 , wherein said forming comprises forming generally L-shaped frames.
8. The method of claim 7 , wherein the generally L-shaped frames each include a fillet having at least one of right angled surfaces, planar surfaces, beveled surfaces, trapezoidal surfaces, or a circular surface.
9. The method of claim 1 , wherein said forming comprises forming generally square shaped frames each having substantially circular openings.
10. The method of claim 9 , wherein each of the resistive thermal devices is disposed along a circumference of the substantially circular opening of each of the generally square shaped frames.