Method for providing an energy assisted magnetic recording head in a wafer packaging configuration
View Patent ↗A method for providing energy assisted magnetic recording (EAMR) heads is described. The method comprises bonding a plurality of lasers to a first substrate. The plurality of lasers corresponds to the plurality of EAMR heads and is for providing energy to a plurality of EAMR transducers. The method further comprises fabricating the plurality of EAMR transducers for the plurality of EAMR heads on a second substrate, bonding the first substrate to the second substrate such that the plurality of EAMR transducers and the plurality of lasers reside between the first substrate and the second substrate, removing at least one of the first substrate and the second substrate, and separating a remaining substrate into the plurality of EAMR heads.
1. A method for providing a plurality of energy assisted magnetic recording (EAMR) heads comprising:
bonding a plurality of lasers to a first substrate, the plurality of lasers corresponding to the plurality of EAMR heads and for providing energy to a plurality of EAMR transducers;
fabricating the plurality of EAMR transducers for the plurality of EAMR heads on a second substrate;
bonding the first substrate to the second substrate such that the plurality of EAMR transducers and the plurality of lasers reside between the first substrate and the second substrate;
removing at least one of the first substrate and the second substrate; and
separating a remaining substrate into the plurality of EAMR heads.
2. The method of claim 1 wherein the step of removing the at least one of the first substrate and the second substrate includes:
removing only the second substrate.
3. The method of claim 1 wherein the plurality of lasers reside on a laser substrate and wherein the step of bonding the plurality of lasers further includes:
wafer bonding the laser substrate to the first substrate; and
thinning the laser substrate.
4. The method of claim 1 wherein the step of fabricating the plurality of EAMR transducers further includes:
fabricating a plurality of read transducers corresponding to the plurality of EAMR heads, the plurality of read transducers residing between the plurality of EAMR transducers and the second substrate.
5. The method of claim 1 wherein the step of fabricating the plurality of EAMR transducers further includes:
fabricating a plurality of read transducers corresponding to the plurality of EAMR heads, the plurality of EAMR transducers residing between the plurality of read transducers and the second substrate.
6. The method of claim 1 wherein the step of fabricating the plurality of EAMR transducers further includes:
fabricating a main pole for each of the plurality of EAMR transducers;
fabricating a near-field transducer (NFT) for each of the plurality of EAMR transducers, the NFT for focusing the energy onto a media; and
fabricating a waveguide for each of the plurality of EAMR transducers, the waveguide directing the energy from at least one laser of the plurality of lasers to the NFT.
7. The method of claim 6 wherein the main pole has a plurality of sides and a pole thermal conductivity and wherein the step of fabricating the plurality of EAMR transducers further includes:
providing a liner on at least the plurality of sides, the liner having liner thermal conductivity greater than the pole thermal conductivity.
8. The method of claim 7 wherein the liner includes at least one of Cu, Ag, and Au.
9. The method of claim 8 further comprising:
providing a soft magnetic layer between the main pole and the second substrate.
10. The method of claim 6 wherein the main pole resides between the NFT and the second substrate.
11. The method of claim 10 wherein the NFT adjoins the main pole.
12. The method of claim 10 further comprising:
providing a layer between the NFT and the main pole.
13. The method of claim 1 further comprising:
providing a sacrificial layer between the second substrate and the plurality of EAMR transducers, the sacrificial layer being a stop layer for a reactive ion etch of the second substrate.
14. A method for providing a plurality of energy assisted magnetic recording (EAMR) heads comprising:
wafer bonding a semiconductor substrate including a plurality of lasers to a first substrate, the plurality of lasers corresponding to the plurality of EAMR heads and for providing energy to a plurality of EAMR transducers;
thinning the semiconductor substrate;
providing a sacrificial layer on a second substrate;
fabricating the plurality of EAMR transducers and a plurality of read transducers for the plurality of EAMR heads on the second substrate, the sacrificial layer residing between the second substrate and the plurality of EAMR transducers, the plurality of EAMR transducers residing between the plurality of read transducers and the second substrate, each of the plurality of EAMR transducers including a main pole, a liner, and a near-field transducer (NFT), the main pole having a top, a plurality of sides and a pole thermal conductivity, the NFT for focusing the energy onto a media, the main pole residing between the NFT and the second substrate, the liner adjoining the plurality of sides of the main pole and having a liner thermal conductivity greater than the pole thermal conductivity;
bonding the first substrate to the second substrate such that the plurality of EAMR transducers and the plurality of lasers reside between the first substrate and the second substrate;
removing the second substrate; and
separating the first substrate into the plurality of EAMR heads.
15. The method of claim 14 wherein the NFT adjoins the top of the main pole.