An insulated wire includes a conductor, and an insulating covering layer formed on a periphery of the conductor and including two or more insulating coatings. The insulating coatings include a polyamide-imide resin insulating material represented by chemical formula 1: where R indicates a divalent aromatic diamine including three or more aromatic rings. The insulating coatings are formed by applying and baking the polyamide-imide resin insulating material, and the polyamide-imide resin insulating material is obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine comprising a divalent aromatic diamine including three or more aromatic rings with an acid using an azeotropic solvent.
1. An insulated wire, comprising:
a conductor; and
an insulating covering layer formed on the periphery of the conductor and comprising two or more insulating coatings,
wherein the insulating covering layer comprises a first insulating coating formed on the periphery of the conductor and a second insulating coating formed on the periphery of the first insulating coating,
wherein the first insulating coating consists of a polyamide-imide resin material synthesized by reacting at least one of the group consisting of 4,4′-diphenylmethane diisocyanate (4,4′-MDI), 2,4′-diphenylmethane diisocyanate (2,4′-MDI) and 4,4′-diphenyl ether diisocyanate with trimellitic anhydride (TMA), the first insulating coating formed by applying to the periphery of the conductor and baking the polyamide-imide resin insulating material,
the second insulating coating consists of a polyamide-imide resin insulating material obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine component consisting of at least one divalent aromatic diamine including three or more aromatic rings selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]ether, and 1,4-bis(4-aminophenoxy)benzene with TMA or benzophenone tricarboxylic acid as an acid using a solvent and the diisocyanate being at least one of the group consisting of 4,4′-diphenylmethane diisocyanate (MDI), 2,2-bis[4-(4-isocyanatephenoxy)phenyl]propane (BIPP), tolylene diisocyanate (TDI), xylylene diisocyanate, diphenyl sulfone diisocyanate and diphenyl ether diisocyanate, and
the second insulating coating formed by applying to the periphery of the first insulating coating and baking the polyamide-imide resin insulating material, and wherein the insulating covering layer has a relative dielectric constant of 3 or less.
2. The insulated wire according to claim 1 , wherein the second insulating coating has a film thickness of 30 μm or more.
3. The insulated wire according to claim 1 , wherein the first insulating coating has a film thickness of 10 μm or less.
4. The insulated wire according to claim 1 , wherein the insulated wire has a partial discharge inception voltage (VP) of at least 970 Vp.
5. The insulated wire according to claim 1 , wherein the insulated wire is capable of being elongated 30% and then wound around a bar that is one to two times the diameter of the insulated wire without the insulating covering layer cracking.
6. The insulated wire according to claim 1 , wherein the second insulating coating consists of a polyamide-imide resin insulating material obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid obtained by the dehydration reaction of 2,2-[bis[4aminophenoxy)phenyl]propane or 1,4-bis(4-aminophenoxy)benzene, as a diamine consisting of a divalent aromatic diamine including three or more aromatic rings with TMA as an acid using an N-methyl-2-pyrrolidone as the solvent and xylene as an azeotropic solvent, and the diisocyanate consisting of 4,4′-diphenylmethane diisocyanate (MDI).
7. An insulated wire, comprising:
a conductor; and
an insulating covering layer formed on the periphery of the conductor and comprising two or more insulating coatings,
wherein the insulating covering layer comprises a first insulating coating formed on the periphery of the conductor and a second insulating coating formed on the periphery of the first insulating coating,
wherein the first insulating coating consists of a polyamide-imide resin material synthesized by reacting at least one of the group consisting of 4,4′-diphenylmethane diisocyanate (4,4′-MDI), 2,4′-diphenylmethane diisocyanate (2,4′-MDI) and 4,4′-diphenyl ether diisocyanate with trimellitic anhydride (TMA), the first insulating coating formed by applying to the periphery of the conductor and baking the polyamide-imide resin insulating material,
the second insulating coating comprising a polyamide-imide resin insulating material obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine component consisting of at least one divalent aromatic diamine including three or more aromatic rings selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]ether, and 1,4-bis(4-aminophenoxy)benzene with TMA or benzophenone tricarboxylic acid as an acid using an azeotropic solvent and the diisocyanate being at least one of the group consisting of 4,4′-diphenylmethane diisocyanate (MDI), 2,2-bis[4-(4-isocyanatephenoxy)phenyl]propane (BIPP), tolylene diisocyanate (TDI), xylylene diisocyanate, diphenyl sulfone diisocyanate and diphenyl ether diisocyanate, and
the second insulating coating formed by applying to the periphery of the first insulating coating and baking the polyamide-imide resin insulating material, and wherein the insulating covering layer has a relative dielectric constant of 3 or less.
8. An insulated wire, comprising:
a conductor; and
an insulating covering layer formed on the periphery of the conductor and comprising two or more insulating coatings,
wherein the insulating covering layer comprises a first insulating coating formed on the periphery of the conductor and a second insulating coating formed on the periphery of the first insulating coating,
wherein the first insulating coating comprises a polyamide-imide resin material synthesized by reacting at least one of the group consisting of 4,4′-diphenylmethane diisocyanate (4,4′-MDI), 2,4′-diphenylmethane diisocyanate (2,4′-MDI) and 4,4′-diphenyl ether diisocyanate with trimellitic anhydride (TMA), the first insulating coating formed by applying to the periphery of the conductor and baking the polyamide-imide resin insulating material,
the second insulating coating consists of a polyamide-imide resin insulating material obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine component consisting of at least one divalent aromatic diamine including three or more aromatic rings selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]ether, and 1,4-bis(4-aminophenoxy)benzene with TMA or benzophenone tricarboxylic acid as an acid using an azeotropic solvent and the diisocyanate being at least one of the group consisting of 4,4′-diphenylmethane diisocyanate (MDI), 2,2-bis[4-(4-isocyanatephenoxy)phenyl]propane (BIPP), tolylene diisocyanate (TDI), xylylene diisocyanate, diphenyl sulfone diisocyanate and diphenyl ether diisocyanate, and
the second insulating coating formed by applying to the periphery of the first insulating coating and baking the polyamide-imide resin insulating material, and wherein the insulating covering layer has a relative dielectric constant of 3 or less.