Card guide system and method

1. A cardguide, comprising:

a cardguide body configured to be disposed in a slot of a computer chassis during use, wherein the slot is configured to house a modular computer device during use;

a track configured to accept an edge of a printed circuit board of the modular computer device configured to be disposed in the slot of the computer chassis during use; and

a clip coupled to a central member, wherein the clip is configured to retain at least a portion of a temperature sensing device during use, wherein the clip provides for positioning the temperature sensing device proximate the slot of the computer chassis during use, and wherein the clip comprises:

a cavity, wherein the cavity is configured to have a width less than at least a portion of the temperature sensing device retained during use thereby at least partially inhibiting removal of the temperature sensing device from the cavity during use via a friction fit; and

a retention member, wherein the retention member is configured to at least partially inhibit removal of the temperature sensing device from the cavity during use, and wherein the retention member comprises a ramped outer portion, wherein the ramped outer portion facilitates insertion into the cavity of at least a portion of the temperature sensing device retained during use.

2. The cardguide of claim 1 , wherein the clip is formed integrally with the central member of the cardguide body.

3. The cardguide of claim 1 , wherein the clip comprises an L-shaped member defining the cavity configured to receive the temperature sensing device during use.

4. The cardguide of claim 3 , wherein the retention member extends from the central member.

5. The cardguide of claim 1 , wherein the clip comprises a C-shaped member defining the cavity configured to receive the temperature sensing device during use.

6. The cardguide of claim 5 , wherein the retention member extends from a portion of the C-shaped member.

7. The cardguide of claim 1 , wherein the temperature sensing device comprises a thermistor.

8. The cardguide of claim 1 , wherein the cardguide comprises a PXI cardguide configured to be disposed in a PXI chassis.

9. The cardguide of claim 1 , wherein the cardguide comprises the clip proximate a center of the central member of the cardguide body and another clip disposed proximate one of a first or a second end of the cardguide.

10. A method, comprising:

coupling to a computer chassis, a cardguide comprising:

a cardguide body configured to be disposed in a slot of the computer chassis during use, wherein the slot is configured to house a modular computer device during use;

a track configured to accept an edge of a printed circuit board of the modular computer device configured to be disposed in the slot of the computer chassis during use; and

a clip coupled to a central member, wherein the clip is configured to retain at least a portion of a temperature sensing device during use, wherein the clip provides for positioning the temperature sensing device proximate the slot of the computer chassis during use, and wherein the clip comprises:

a cavity, wherein the cavity is configured to have a width less than at least a portion of the temperature sensing device retained during use thereby at least partially inhibiting removal of the temperature sensing device from the cavity during use via a friction fit; and

a retention member, wherein the retention member is configured to at least partially inhibit removal of the temperature sensing device from the cavity during use, and wherein the retention member comprises a ramped outer portion, wherein the ramped outer portion facilitates insertion into the cavity of at least a portion of the temperature sensing device retained during use; and

disposing the temperature sensing device in the clip, wherein the temperature sensing device is configured to detect an internal temperature of the computer chassis proximate the slot of the computer chassis during use.

11. The method of claim 10 , wherein the clip is formed integrally with the cardguide body.

12. The method of claim 10 , wherein the clip comprises an L-shaped member defining the cavity configured to receive the temperature sensing device during use.

13. The method of claim 12 , wherein the retention member extends from the central member.

14. The method of claim 10 , wherein the clip comprises a C-shaped member defining the cavity configured to receive the temperature sensing device during use.

15. The method of claim 14 , wherein the retention member extends from a portion of the C-shaped member.

16. The method of claim 10 , wherein the temperature sensing device comprises a thermistor.

17. The method of claim 10 , wherein the cardguide comprises a PXI cardguide and configured to be disposed in a PXI computer chassis.

18. The method of claim 10 , wherein the cardguide comprises the clip proximate a center of the central member of the cardguide body and another clip disposed proximate one of a first or a second end of the cardguide.

19. A system, comprising:

a cardguide configured to be disposed in a computer chassis during use, wherein the cardguide comprises:

a track configured to accept an edge of a printed circuit board of a modular computer device configured to be disposed in the track during use; and

an integral clip configured to retain at least a portion of a temperature sensing device during use, wherein the integral clip provides for positioning the temperature sensing device within the computer chassis during use, and wherein the clip comprises:

a cavity, wherein the cavity is configured to have a width less than at least a portion of the temperature sensing device retained during use thereby at least partially inhibiting removal of the temperature sensing device from the cavity during use via a friction fit; and

a retention member, wherein the retention member is configured to at least partially inhibit removal of the temperature sensing device from the cavity during use, and wherein the retention member comprises a ramped outer portion, wherein the ramped outer portion facilitates insertion into the cavity of at least a portion of the temperature sensing device retained during use.

20. The system of claim 19 , wherein a wire of the temperature sensing device is disposed in the integral clip such that that temperature sensing device is retained in a position proximate to the cardguide.