Manufacturing method of flat panel display
View Patent ↗A manufacturing method of a flat panel display according to an exemplary embodiment of the present invention includes: coating a first adhering member on a first supporting plate; disposing a first substrate on the first adhering member; using ultrasonic waves to adhere the first supporting plate and the first substrate; and forming a gate line, a data line, a thin film transistor connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor on the first substrate. According to the manufacturing method of the flat panel display according to an exemplary embodiment of the present invention, the first adhering member made of the plurality of adhering particles is melted by using the ultrasonic waves without an additional adhering film to adhere the flexible first substrate and the first supporting plate, thereby reducing the overall manufacturing cost.
1. A method for manufacturing a flat panel display, the method comprising:
coating a first adhering member on a first supporting plate, the first adhering member including a plurality of adhering particles and a polyelectrolyte;
disposing a first substrate on the first adhering member;
using ultrasonic waves to adhere the first supporting plate to the first substrate; and
forming a gate line, a data line, a thin film transistor connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor on the first substrate,
wherein the polyelectrolyte electrostatically couples the plurality of adhering particles to the first supporting plate.
2. The method of claim 1 , further comprising:
coating a second adhering member on a second supporting plate;
disposing a second substrate on the second adhering member;
using ultrasonic waves to adhere the second supporting plate to the second substrate; and
forming a common electrode on the second substrate.
3. The method of claim 2 , further comprising:
combining the first substrate and the second substrate; and
removing the first adhering member and the second adhering member by using a laser beam to separate the first supporting plate and the second supporting plate from the first substrate and the second substrate, respectively.
4. The method of claim 1 , wherein
the first adhering member is formed on the first supporting plate by using an ultrasonic wave spray coating device.
5. The method of claim 1 , wherein
the first adhering member has a thickness of about 10 nm to about 1 μm.
6. The method of claim 5 , wherein
the adhering particles include particles having diameters of less than a micrometer.
7. The method of claim 1 , wherein
the adhering particles include particles having diameters of about a nanometer.
8. The method of claim 1 , wherein
the plurality of adhering particles include first adhering particles having a first reactor and second adhering particles having a second reactor, and the first adhering particles having the first reactor and the second adhering particles having the second reactor are combined by the ultrasonic waves.
9. A method for manufacturing a flat panel display, the method comprising:
coating a first adhering member on a first substrate, the first adhering member including a plurality of adhering particles and a polyelectrolyte;
disposing the first substrate coated with the first adhering member on a first supporting plate to place the first adhering member in contact with the first supporting plate;
using ultrasonic waves to adhere the first supporting plate and the first substrate; and
forming a gate line, a data line, a thin film transistor connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor on the first substrate,
wherein the polyelectrolyte electrostatically couples the plurality of adhering particles to the first supporting plate.
10. The method of claim 9 , further comprising:
coating a second adhering member on a second substrate;
disposing the second substrate coated with the second adhering member on the second supporting plate to place the second adhering member in contact with the second supporting plate;
using ultrasonic waves to adhere the second supporting plate and the second substrate; and
forming a common electrode on the second substrate.
11. The method of claim 9 , wherein
the first adhering member is formed on the first substrate by using an ultrasonic wave spray coating device.
12. The method of claim 9 , wherein
the first adhering member has a thickness of about 10 nm to about 1 μm.
13. The method of claim 9 , wherein
the plurality of adhering particles include first adhering particles having a first reactor and second adhering particles having a second reactor, and the first adhering particles having the first reactor and the second adhering particles having the second reactor are combined by the ultrasonic waves.
14. The method of claim 10 , further comprising:
combining the first substrate and the second substrate; and
removing the first adhering member and the second adhering member by using a laser beam to separate the first supporting plate and the second supporting plate from the first substrate and the second substrate.