Printhead integrated circuit having low mass heater elements
View Patent ↗A printhead integrated circuit includes: a plurality of nozzle chambers disposed on a substrate; a heater element positioned in each nozzle chamber; drive circuitry for supply power to each heater element; and a plurality of ink supply channels defined in the substrate for supplying fluid to the nozzle chambers. Each heater element consists of solid material having a mass of less than 10 nanograms. In use, the solid material is heated to cause formation of a gas bubble inside each nozzle chamber.
1. A printhead integrated circuit comprising:
a plurality of nozzle chambers disposed on a substrate, each nozzle chamber having a respective nozzle opening;
a heater element positioned in each nozzle chamber for heating fluid within the chamber to form a gas bubble therein and thereby cause ejection of a drop from the respective nozzle opening;
drive circuitry for supply power to each heater element; and
a plurality of ink supply channels defined in the substrate for supplying fluid to the plurality of nozzle chambers,
wherein each heater element comprises solid material having a mass of less than 10 nanograms, the solid material being configured to be heated to cause formation of the gas bubble.
2. A printhead integrated circuit according to claim 1 wherein the substrate is a passivated CMOS substrate, and wherein the drive circuitry is disposed in a CMOS layer thereof.
3. A printhead integrated circuit according to claim 1 wherein each heater element is configured to cause formation of the gas bubble upon receipt of heating energy of less than 500 nanojoules.
4. A printhead integrated circuit according to claim 1 wherein each heater is configured to cause formation of the gas bubble upon receipt of heating energy of less than the heating energy required to heat a volume of the ink equal to the volume of the ink drop from a temperature at which the ink is supplied from the associated ink supply passage to a boiling point of the ink.
5. A printhead integrated circuit according to claim 1 wherein each heater is configured so that the gas bubble is formed at each of two opposing sides of the heater.
6. A printhead integrated circuit according to claim 1 wherein each nozzle chamber comprises a roof spaced apart from said substrate and sidewalls extending from said roof to said substrate.
7. A printhead integrated circuit according to claim 6 , wherein said roof and sidewalls are co-deposited by a CVD process such that said roof and sidewalls are seamlessly fused together.
8. A printhead integrated circuit according to claim 6 wherein each roof defines part of a nozzle plate for said printhead integrated circuit.
9. A printhead integrated circuit according to claim 8 , wherein said nozzle plate is comprised of silicon nitride, silicon oxide or silicon oxo-nitride.
10. A printhead integrated circuit according to claim 1 , wherein said nozzle plate has a thickness of less than 2.5 microns.