Full tape thickness feature conductors for EMI structures
View Patent ↗Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.
1. A method for making a full tape thickness conductor in a plurality of dielectric tape layers, comprising:
removing dielectric material to form a first slot through the thickness of a first said tape layer;
filling the first slot with material comprising the conductor;
drying the material in the first slot;
removing dielectric material to form a second slot through the thickness of a second said tape layer;
filling the second slot with material comprising the conductor;
drying the material in the second slot;
stacking said first and second tape layers to form a tape stack with said first and second slots in overlapping relationship to one another;
removing dielectric material to form through the first and second tape layers, as already stacked in said tape stack, a third slot that contacts said first and second slots;
filling the third slot with material comprising the conductor; and
drying the material in the third slot.
2. The method of claim 1 , including, before said stacking, performing said forming, filling and drying with respect to a plurality of pairs of said first and second slots in the respective first and second tape layers, and further including performing said forming, filling and drying with respect to a plurality of said third slots in the first and second tape layers, wherein said first, second and third slots collectively form a generally annular full tape thickness conductor in the tape stack.
3. The method of claim 2 , including forming a plurality of said generally annular full tape thickness conductors in a corresponding plurality of said tape stacks, and stacking said tape stacks to form a substrate containing a generally annular solid conductive wall comprising said full tape thickness conductors.
4. The method of claim 3 , including providing said wall to surround a circuit as part of an electromagnetic isolation structure.
5. The method of claim 4 , including providing a ground plane and a further conductive structure adjoining respectively opposite ends of said wall in the electromagnetic isolation structure.
6. The method of claim 4 , including firing the substrate to produce a low temperature co-fired ceramic structure.
7. The method of claim 1 , wherein said first and second slots are laterally offset from one another in said tape stack.
8. A method for making a full tape thickness conductor in a plurality of dielectric tape layers, comprising:
removing dielectric material to form a first slot through the thickness of a first said tape layer;
filling the first slot with material comprising the conductor;
drying the material in the first slot;
stacking said first tape layer and a second said tape layer that has a ground plane disposed thereon, to form a tape stack;
removing dielectric material to form through the first and second tape layers, as already stacked in said tape stack, a second slot that contacts the first slot and the ground plane;
filling the second slot with material comprising the conductor; and
drying the material in the second slot.
9. The method of claim 8 , including performing said forming, filling and drying with respect to a plurality of said first slots and a plurality of said second slots to form a generally annular full tape thickness conductor in said first tape layer.
10. The method of claim 9 , including providing said generally annular full tape thickness conductor as part of a solid conductive wall in an electromagnetic isolation structure surrounding a circuit.
11. A method for making a full tape thickness conductor in a dielectric tape layer, comprising:
forming a first set of slots through the thickness of said tape layer and spaced apart from one another in said tape layer;
filling the first set of slots with material comprising the conductor;
drying the material in the first set of slots;
after said forming, filling and drying, forming through the thickness of said tape layer a second set of slots that are interposed between and contact respectively associated spaced apart pairs of the first set of slots;
filling the second set of slots with material comprising the conductor; and
drying the material in the second set of slots.
12. The method of claim 11 , wherein the dried material in said first and second slots forms a generally annular full tape thickness conductor in said tape layer.
13. The method of claim 12 , including forming a plurality of said generally annular full tape thickness conductors in a corresponding plurality of tape layers, and stacking said tape layers to form a substrate having therein a generally annular solid conductive wall comprising said full tape thickness conductors.
14. The method of claim 13 , including providing said wall as part of an electromagnetic isolation structure surrounding a circuit.
15. The method of claim 14 , including providing a ground plane and a further conductive structure adjoining respectively opposite ends of said wall in the electromagnetic isolation structure.
16. The method of claim 14 , including firing the substrate to produce a low temperature co-fired ceramic structure.
17. The method of claim 11 , wherein the tape layer is a composite tape layer including at least two constituent dielectric tape layers stacked on one another.