IP Library Granted Patent US 8,647,554
Granted Patent B2
US 8,647,554 · App. 12/835,009 · Granted Feb 11, 2014

Residual layer thickness measurement and correction

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Quick Facts
Patent No.
US 8,647,554
App. No.
12/835,009
Granted
Feb 11, 2014
Kind
B2
Abstract

In nano-imprint lithography it is important to detect thickness non-uniformity of a residual layer formed on a substrate. Such non-uniformity is compensated such that a uniform residual layer may be formed. Compensation is performed by calculating a corrected fluid drop pattern.

Claims (40)

1. In an imprint lithography system, a method comprising:

depositing a plurality of drops of polymerizable imprint fluid on a substrate, the plurality of drops having a drop pattern in which each of the plurality of drops has an assigned size and position on the substrate;

performing a first imprint of the plurality of drops of polymerizable imprint fluid by varying the distance between a mold and the substrate to define a desired volume therebetween filled by the imprint fluid and then solidifying the imprint fluid resulting in a first patterned imprinted layer having a residual layer;

measuring a variation of thicknesses of sub-portions of the residual layer at a plurality of points;

calculating a new drop pattern that compensates for nonuniformities in the thickness of the residual layer by adjusting the assigned size and position of certain ones of the plurality of drops; and

performing a second imprint of a plurality of drops using the new drop pattern resulting in a second imprinted layer having a uniform residual layer thickness.

2. The method of claim 1 , further comprising measuring a thickness of a residual layer of the second imprinted layer.

3. The method of claim 2 , wherein the second imprinted layer has a residual layer with desired uniformity of the thickness.

4. The method of claim 1 , wherein the measuring the variation of thicknesses of subportions at a plurality of points of the residual layer further includes:

employing a film thickness measurement tool; and

employing a processor operated on a computer readable program to analyze and construct a map of the thickness of the sub-portions.

5. The method of claim 4 , wherein the film thickness measurement tool provides an image of the first imprinted layer.

6. The method of claim 5 , wherein the processor uses an algorithm to convert the image into an imprint area.

7. The method of claim 6 , wherein the processor converts differences in color and shade grades of the image into a Z-height profile of the first imprinted layer.

8. The method of claim 4 , wherein the map of the thickness of the sub-portions is obtained using a polynomial two-dimensional function with assigned specific thickness to each point.

9. The method of claim 8 , wherein average thickness of the points and deviation from the average is determined.

10. The method of claim 9 , wherein deviation is used to provide local unit fluid volume, number of drops, position of drops and drop volume.

11. The method of claim 1 , wherein adjusting the assigned size and position of certain ones of the plurality of drops includes adding droplets.

12. The method of claim 1 , wherein adjusting the assigned size and position of certain ones of the plurality of drops includes subtracting droplets.

13. In an imprint lithography system, a method comprising:

imprinting a first field on a substrate using a first drop pattern of polymerizable fluid, the first drop pattern having a plurality of drops with each drop assigned a size and a position on the substrate, the first field formed by solidifying the polymerizable fluid between a mold and the substrate, the formed first field having a first residual layer;

measuring thickness of the first residual layer across a dense array of points in the imprinted first field using a film thickness measurement tool;

altering the first drop pattern based on the thickness measurements of the first residual layer to provide a second drop pattern, the second drop pattern configured to provide a substantially uniform residual layer; and

imprinting a second field using the second drop pattern.

14. The method of claim 13 , wherein the second drop pattern compensates for evaporation of the plurality of drops.

15. The method of claim 13 , further comprising calibrating the imprint lithography system to determine how much fluid to dispense on the substrate to make the first field with a desired thickness.

16. The method of claim 13 , wherein the first drop pattern is a uniform distribution of the fluid on the substrate.

17. The method of claim 13 , wherein altering includes adding droplets.

18. The method of claim 13 , wherein altering includes subtracting droplets.

19. An imprint lithography method comprising:

depositing a plurality of drops of polymerizable imprint fluid on a substrate, the plurality of drops having a drop pattern in which each of the plurality of drops has an assigned size and position on the substrate;

varying the distance between an imprint lithography template having a patterning surface thereon and the substrate to define a desired volume therebetween filled by the imprint fluid;

solidifying the imprint fluid to form a first patterned layer conforming to the patterning surface, the patterned layer having a residual layer;

separating the imprint lithography template from the formed first patterned layer;

measuring the thickness of the residual layer at a plurality of points;

mapping the thickness of the residual layer as a two dimensional function, f(x,y) with an assigned thickness for each measured point;

calculating the average thickness, g(x,y), of the residual layer;

calculating the deviation from the average as w(x,y)=g(x,y)−f(x,y); and

altering the first drop pattern by calculating offsets in the x and y direction based on g(x,y) and adjusting local unit fluid volume, number of drps, position of drops and drop volume based on deviation w(x,y) to provide a second drop pattern that provides for a substantially uniform residual layer.

20. The method of claim 19 further comprising forming a second patterned layer on a substrate using the second drop pattern.

Assignments (2)
ASSIGNMENT OF SECURITY INTEREST IN PATENTS Recorded Nov 7, 2019
From: JPMORGAN CHASE BANK, N.A.
To: CITIBANK, N.A.
Reel/Frame 050967/0138 →
PATENT SECURITY AGREEMENT Recorded Aug 22, 2019
From: MAGIC LEAP, INC.; MOLECULAR IMPRINTS, INC.; MENTOR ACQUISITION ONE, LLC
To: JP MORGAN CHASE BANK, N.A.
Reel/Frame 050138/0287 →