Direct attach optical receiver module and method of testing
View Patent ↗A direct attach optical receiver module and a system and method for testing the direct attach optical receiver module are provided. An optical receiver module may include an optical detector and an integrated circuit with an integrated amplifier circuit and at least one integrated capacitor. In one example, the optical detector may be physically attached to the integrated circuit and the output port of the optical detector may be electrically coupled to the input port of the integrated circuit. In another example, a redistribution layer that includes a tuning inductor may be being physically attached between the optical detector and the integrated circuit.
1. An optical receiver module, comprising:
a housing;
a plurality of header pins attached to the housing and electrically isolated from the housing;
an aperture disposed in the housing for providing light through the housing;
an optical detector that receives light and generates photocurrent in response to the received light; and
an integrated circuit that receives the photocurrent and amplifies the photocurrent to generate an output signal;
the integrated circuit being formed on a single substrate, the single substrate being made from a semiconductor material;
the optical detector being mounted within the housing between the plurality of header pins such that it is proximate the aperture and positioned for receiving light;
the optical detector being electrically connected exclusively to the integrated circuit;
wherein all of the electrically isolated header pins within the optical receiver module include at least one wire bond connected exclusively to the integrated circuit.
2. The optical receiver module of claim 1 , wherein the optical receiver does not include any decoupling capacitors within the housing other than one or more decoupling capacitors that are integral to the integrated circuit.
3. The optical receiver module of claim 1 , wherein the optical detector is electrically coupled to the integrated circuit using a flip-chip bond.
4. The optical receiver module of claim 1 , wherein the optical detector is electrically coupled to the integrated circuit using a wire bond.