Circuit device
View Patent ↗Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.
1. A circuit device, comprising:
a case member;
a first circuit board attached to a bottom portion of the case member;
a second circuit board fitted into the case member so as to define an internal space between the first and second circuit boards;
a semiconductor element mounted on a principal surface of the first circuit board; and
a circuit element mounted on a principal surface of the second circuit board and controlling the semiconductor element,
wherein the first circuit board is smaller than the second circuit board,
the bottom portion of the case member comprises a lattice-like frame having a center lattice cell opening into which the first circuit board fits and a peripheral lattice cell opening that is connected to the internal space of the case member so that the internal space and the peripheral opening of the bottom portion form a conduit for air flow, and
a bottom surface of the first circuit board opposite from the principal surface on which the semiconductor element is mounted is not covered by any device element of the circuit device so that the bottom surface of the first circuit board is exposed.
2. The circuit device of claim 1 , further comprising a sealing resin covering at least the principal surface of the first circuit board and the semiconductor element.
3. The circuit device of claim 1 , wherein the lattice-like frame of the case member has a plurality of peripheral lattice cell openings connected to the internal space of the case member, and in plan view of the circuit device the first circuit board is surrounded by the peripheral lattice cell openings.
4. The circuit device of claim 1 , wherein a sidewall of the case member has an opening connected to the internal space of the case member.
5. The circuit device of claim 1 , wherein the peripheral lattice cell opening in the lattice-like frame is covered by the second circuit board.
6. The circuit device of claim 1 , further comprising a conductive pad and a lead disposed on the conductive pad and penetrating through the second circuit board, wherein the semiconductor element and the circuit element are connected through the lead.
7. A circuit device, comprising:
a case member comprising a bottom portion and a sidewall portion, the bottom portion comprising a lattice-like frame having a center lattice cell opening in a middle portion of the lattice-like frame and also having additional lattice cell openings surrounding the center lattice cell opening;
a first circuit board mechanically engaging with the center lattice cell opening of the lattice-like frame;
a second circuit board fitted into the case member by mechanically engaging with the sidewall of the case member, the first and second circuit boards and the sidewall of the case member defining an internal space of the circuit device, the first circuit board being smaller than the second circuit board, and the internal space and the additional lattice cell openings being connected to form a conduit for air flow;
a semiconductor element mounted on the first circuit board; and
a circuit element mounted on the second circuit board and controlling the semiconductor element.