Internal member of a plasma processing vessel
An internal member of a plasma processing vessel includes a base material and a film formed by thermal spraying of ceramic on a surface of the base material. The film is formed of ceramic which includes at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd. In addition, at least a portion of the film is sealed by a resin.
1. An internal member of a plasma processing vessel, comprising:
a base material, wherein the base material comprises at least one of stainless steel, Al, Al alloy, W, W alloy, Ti, Ti alloy, Mo, Mo alloy, carbon, oxide or non-oxide based sintered ceramic body, and carbonaceous material; and
a film formed by thermal spraying of ceramic on a surface of the base material, wherein the film is formed of ceramic including at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd, and at least a portion of the film is sealed by a sol-gel method to form a sealing-treated portion,
wherein the sealing-treated portion is formed in a lower portion of the film to make a contact with the base material by using Y203, and
wherein the sealing-treated portion is not formed in an upper portion of the film to suppress surface degradation of the film.
2. The internal member of claim 1 , wherein the ceramic is at least one kind of ceramic selected from the group consisting of B 4 C, MgO, Al 2 O 3 , SiC, Si 3 N 4 , SiO 2 , CaF 2 , Cr 2 O 3 , Y 2 O 3 , YF 3 , ZrO 2 , TaO 2 , CeO 2 , Ce 2 O 3 , CeF 3 and Nd 2 O 3 .
3. An internal member of a plasma processing vessel, comprising:
a base material, wherein the base material comprises at least one of stainless steel, Al, Al alloy, W, W alloy, Ti, Ti alloy, Mo, Mo alloy, carbon, oxide or non-oxide based sintered ceramic body, and carbonaceous material; and
a film formed by thermal spraying of ceramic on a surface of the base material,
wherein the film is formed of ceramic including at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd, and at least a portion of the film is sealed by a sol-gel method to form a sealing-treated portion,
wherein an anodic oxidized film is formed between the base material and the film,
wherein the sealing treatment is executed by using Y203, and
wherein the sealing-treated portion is formed in a lower portion of the film to make a contact with the anodic oxidized film and wherein the sealing-treated portion is not formed in an upper portion of the film to suppress surface degradation of the film.
4. The internal member of claim 3 , wherein the anodic oxidized film is sealed by an aqueous solution of metal salt.
5. The internal member of claim 3 , wherein the anodic oxidized film is sealed by a resin selected from the group consisting of SI (silicone), PTFE (polytetrafluoroethylene), PI (polyimide), PAI (polyamideimide), PEI (polyetherimide), PBI (polybenzimidazole) and PFA (perfluoroalkoxyalkane).