Electrostatic capacitance input device and electro-optical device having input device

1. An electrostatic capacitance input device comprising:

an input region of a substrate, in which a plurality of input position detection electrodes are provided;

a plurality of wires that are electrically connected to the plurality of input position detection electrodes and extend outside the input region of the substrate;

a shield electrode that overlaps the wires on the input operation side, wherein

a first conductive film, interlayer insulating film and second conductive film are formed in this order from the substrate side on the substrate,

of the first and second conductive films, at least either of the two conductive films is used to form the input position detection electrodes,

of the first and second conductive films, the conductive film on the side opposite to the input operation side is used to form the wires, and

of the first and second conductive films, the conductive film on the input operation side is used to form the shield electrode.

2. The electrostatic capacitance input device of claim 1 wherein

of the first and second conductive films, the conductive film on the side opposite to the input operation side is used to form a shielding auxiliary electrode on the outer periphery side of the wires on the substrate, and

the shielding auxiliary electrode and shield electrode overlap and are electrically connected together in the region free from the interlayer insulating film.

3. The electrostatic capacitance input device of claim 2 wherein

the shielding auxiliary electrode is formed along all the sides of the substrate, and

the shielding auxiliary electrode and shield electrode overlap and are electrically connected together all along the longitudinal direction of the shielding auxiliary electrode.

4. The electrostatic capacitance input device of claim 1 wherein

of the first and second conductive films, at least either of the two conductive films is used to provide first and second mounting terminals outside the input region of the substrate, and

the first mounting terminals are connected to the wires, and the second mounting terminals to the shield electrode.

5. The electrostatic capacitance input device of claim 1 wherein

of the first and second conductive films, at least either of the two conductive films is used to provide, on the substrate, a plurality of first input position detection electrodes and a plurality of second input position detection electrodes as the input position detection electrodes,

the first input position detection electrodes extend in a first direction in an in-plane direction of the substrate,

the second input position detection electrodes extend in a second direction that intersects the first direction in an in-plane direction of the substrate,

a junction portion, interruption portion and relay electrode are provided at each of the intersecting portions between the first and second input position detection electrodes,

the junction portion allows for one of the first and second input position detection electrodes to be continuous and comprises the one of the first and second conductive films,

the interruption portion is a portion where the other of the first and second input position detection electrodes is interrupted,

the relay electrode overlaps the junction portion via the interlayer insulating film to electrically connect the interruption portion of the other of the first and second input position detection electrodes, and

the relay electrode comprises the other of the first and second conductive films.

6. The electrostatic capacitance input device of claim 1 wherein

the first conductive film, interlayer insulating film and second conductive film are formed on a substrate surface on the input operation side of the substrate,

the wires are formed with the first conductive film, and

the shield electrode is formed with the second conductive film.

7. The electrostatic capacitance input device of claim 1 wherein

the first conductive film, interlayer insulating film and second conductive film are formed on a substrate surface on the side opposite to the input operation side of the substrate,

the wires are formed with the second conductive film, and

the shield electrode is formed with the first conductive film.