Circuit board pad having impedance matched to a transmission line and method for providing same
View Patent ↗The present invention provides a transmission line portion for a circuit board including a conductive strip and a pad portion including a conductive pad connected to the conductive strip, wherein an impedance discontinuity or mismatch between the transmission line portion and the pad portion is reduced or controlled. Impedance discontinuity or mismatch may be controlled by controlling the dimensions of the pad portion, for example the pad width or distance between pad and ground. A ground pad associated with the pad portion may be provided on a different layer than a ground plane of the transmission line portion. The ground pad and ground plane may be connected by vias. The ground pad may comprise a patterned conductive region, the pattern configured so as to desirably configure impedance of the pad portion. Also provided are a method, circuit board layout, and the like, related to the above.
1. A transmission line element for a circuit board, the transmission line element comprising:
a) a transmission line portion including a conductive strip, a ground plane, and a first dielectric region, the conductive strip having a first width, the first dielectric region separating the conductive strip and the ground plane by a first distance; and
b) a pad portion including a conductive pad electrically coupled to the conductive strip, the conductive pad having a width greater than said first width, the pad portion further including a ground pad and a second dielectric region, the second dielectric region separating the conductive pad from the ground pad by a second distance greater than said first distance;
wherein the pad portion is configured to provide an impedance characteristic generally matched with a corresponding impedance characteristic of the transmission line portion, and wherein the conductive pad is a test pad configured to provide an electrical connection for an external probe for circuit testing.
2. The transmission line element according to claim 1 , wherein the ground pad comprises a patterned conductive region, and wherein configuration of the pad portion includes configuration of one or more characteristics of the patterned conductive region.
3. The transmission line element according to claim 1 , further comprising one or more conductive connectors for providing a predetermined electrical coupling between the ground pad and the ground plane.
4. The transmission line element according to claim 3 , wherein one or more or the conductive connectors are configured as vias.
5. A circuit board comprising a transmission line element the transmission line element comprising:
a) a transmission line portion including a conductive strip, a ground plane, and a first dielectric region, the conductive strip having a first width, the first dielectric region separating the conductive strip and the ground plane by a first distance; and
b) a pad portion including a conductive pad electrically coupled to the conductive strip, the conductive pad having a width greater than said first width, the pad portion further including a ground pad and a second dielectric region, the second dielectric region separating the conductive pad from the ground pad by a second distance greater than said first distance;
wherein the pad portion is configured to provide an impedance characteristic generally matched with a corresponding impedance characteristic of the transmission line portion, and wherein the conductive pad is a test pad configured to provide an electrical connection for an external probe for circuit testing.
6. A method for providing a transmission line element for a circuit board, the method comprising:
a) providing a transmission line portion including a conductive strip, a ground plane, and a first dielectric region, the conductive strip having a first width, the first dielectric region separating the conductive strip and the ground plane by a first distance;
b) providing a pad portion including a conductive pad electrically coupled to the conductive strip, the conductive pad having a width greater than said first width, the pad portion further including a ground pad and a second dielectric region, the second dielectric region separating the conductive pad from the ground pad by a second distance greater than said first distance; and
configuring the pad portion to provide an impedance characteristic generally matched with a corresponding impedance characteristic of the transmission line portion, wherein the conductive pad is a test pad configured to provide an electrical connection for an external probe for circuit testing.
7. The method according to claim 6 , wherein the ground pad comprises a patterned conductive region, and wherein configuring the pad portion includes configuration of one or more characteristics of the patterned conductive region.
8. The method according to claim 6 , further comprising providing one or more conductive connectors for providing a predetermined electrical coupling between the ground pad and the ground plane.
9. The method according to claim 6 , wherein one or more of the conductive connectors are configured as vias.