Capacitor with sacrificial lead wire configuration and improved manufacturing method thereof
View Patent ↗The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
1. A method for forming a capacitor comprising:
pressing a powder into a monolith comprising at least one anode lead wire and a sacrificial lead wire extending there from;
engaging said sacrificial lead with a transport device;
transporting said anode to a dielectric formation station wherein dielectric is formed on said pressed anode forming an anodized anode;
transporting said anodized anode to a cathode application station wherein a cathode is formed on said dielectric; and
disengaging said sacrificial lead wire from said transport device.
2. The method for forming a capacitor of claim 1 further comprising at least one of attaching said anode lead wire to an anode termination and attaching said cathode to a cathode termination.
3. The method for forming a capacitor of claim 1 wherein said dielectric is formed by electrochemical oxidation of said anode.
4. The method for forming a capacitor of claim 1 wherein said sacrificial lead wire and at least one anode lead wire extends from a common face.
5. The method for forming a capacitor of claim 1 wherein said sacrificial lead wire and at least one anode lead wire extend from adjacent faces.
6. The method for forming a capacitor of claim 1 wherein said powder comprises at least one conductor selected from mixtures, alloys or conductive oxides of Al, W, Ta, Nb, Ti, Zr and Hf.
7. The method for forming a capacitor of claim 6 wherein said powder comprises at least one material selected from the group consisting of Al, Ta, Nb and NbO.
8. The method for forming a capacitor of claim 1 wherein said anode lead wire extends into said anode further than said sacrificial anode wire.
9. The method for forming a capacitor of claim 1 wherein said anode lead wire has a larger cross-sectional area than said sacrificial lead wire.
10. The method for forming a capacitor of claim 1 further comprising providing substrate comprising a via and inserting said anode lead wire into said via.
11. The method for forming a capacitor of claim 10 wherein said substrate is a conductor.
12. The method for forming a capacitor of claim 11 wherein said substrate is an electrical contact between an anode termination and said anode lead.
13. The method for forming a capacitor of claim 1 further comprising attaching said capacitor to a substrate.
14. The method for forming a capacitor of claim 13 further comprising attaching an electronic package to said substrate wherein said electronic package is in electrical connection with said capacitor.