Optoelectronic system

1. A method of making an optoelectronic system comprising:

providing a temporary substrate;

providing un-packaged optoelectronic elements having sidewalls, top surfaces, and bottom surfaces, at least one of the unpackaged optoelectronic elements having an electrode provided on a side of the bottom surfaces;

attaching the bottom surfaces to the temporary substrate such that a trench is formed between two of the un-packaged optoelectronic elements;

providing an adhesive material to fully fill the trench and cover the un-packaged. optoelectronic elements such that the sidewalls and top surfaces of the un-packaged optoelectronic elements are fully enclosed by the adhesive material;

providing a transparent substrate on the adhesive material; and

removing the temporary substrate without removing all the adhesive material covering the optoelectronic elements.

2. The method of claim 1 further comprising: providing a first connecting layer on the temporary substrate to connect the un-packaged optoelectronic elements.

3. The method of claim 1 , wherein the un-packaged optoelectronic elements comprises a. light-emitting diode.

4. The method of claim 1 further comprising: providing a phosphor layer on at least one of the top surfaces of the un-packaged optoelectronics elements.

5. The method of claim 1 further comprising: providing a fan-out electrode on an electrode of one of the un-packaged optoelectronic elements, wherein the fan-out electrode is wider than the electrode.

6. The method of claim 1 further comprising: providing a fan-out electrode electrically connected to at least one of the un-packaged optoelectronic elements and extending outside a boundary of the at least one of the un-packaged optoelectronic elements.

7. The method of claim 1 further comprising: providing a second connecting layer between the transparent substrate and at least one of the un-packaged optoelectronic elements.

8. The method of claim 7 , wherein the second connecting layer comprises a channel.

9. The method of claim 1 further comprising: providing a micro-pyramid between two of the un-packaged optoelectronic elements.

10. The method of claim 1 , wherein at least one of the top surfaces is devoid of a metal layer.

11. The method of claim 1 , wherein the attaching step comprises preparing the un-packaged optoelectronic elements which have a growth substrate covered by the adhesive material.

12. The method of claim 1 , wherein, in the step of attaching the bottom surface to the temporary substrate, the electrode is directly attached to the temporary substrate.

13. The method of claim 12 , wherein the electrode has an elevation higher than the adhesive material.

14. The method of claim 1 , further comprising electrically coupling the optoelectronic elements in series, in parallel, or both.

15. The method of claim 1 , wherein the electrode is exposed after removing the temporary substrate.

16. The method of claim 1 , wherein the adhesive material is attached to the side walls of the un-packaged optoelectronic elements after removing the temporary substrate.

17. The method of claim 1 , further comprising a step of dividing the transparent substrate after removing the temporary substrate.

18. The method of claim 1 , further comprising a step of providing a reflecting layer on the transparent substrate.

19. The method of claim 1 further comprising: providing a phosphor powder mixed with the adhesive layer.