Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
View Patent ↗An integrated circuit includes a first integrated circuit die having a first circuit and a first inductive interface and a second integrated circuit die having a second circuit and a second inductive interface. A substrate is coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate signals between the first circuit and the second circuit.
1. A method comprising:
providing a first inductive interface of a first integrated circuit die and a second inductive interface of a second integrated circuit die in alignment with a magnetic communication path included in a substrate by:
aligning a third coil of the magnetic communication path with a first coil of the first integrated circuit die; and
aligning a fourth coil of the magnetic communication path with a second coil of the first integrated circuit die; and
magnetically communicating signals between a first circuit of the first integrated circuit die and a second circuit of the second integrated circuit die via the first inductive interface and the second inductive interface and via the magnetic communication path.
2. The method of claim 1 further comprising:
bonding the first integrated circuit die to the substrate via a ferromagnetic glue.
3. The method of claim 2 further comprising:
bonding the second integrated circuit die to the substrate via a ferromagnetic glue.
4. The integrated circuit of claim 1 wherein the magnetic communication path includes a ferromagnetic material.
5. The method of claim 1 wherein magnetically communicating signals includes bidirectionally communicating signals between the first circuit and the second circuit.
6. A method comprising:
providing a first inductive interface of a first integrated circuit die and a second inductive interface of a second integrated circuit die in alignment with a magnetic communication path included in a substrate by:
planarly aligning a third coil of the magnetic communication path with a first coil of the first integrated circuit die; and
planarly aligning a fourth coil of the magnetic communication path with a second coil of the first integrated circuit die; and
magnetically communicating signals between a first circuit of the first integrated circuit die and a second circuit of the second integrated circuit die via the first inductive interface and the second inductive interface and via the magnetic communication path.
7. The method of claim 6 further comprising:
bonding the first integrated circuit die to the substrate via a ferromagnetic glue.
8. The method of claim 7 further comprising:
bonding the second integrated circuit die to the substrate via a ferromagnetic glue.
9. The integrated circuit of claim 6 wherein the magnetic communication path includes a ferromagnetic material.
10. The method of claim 6 wherein magnetically communicating signals includes bidirectionally communicating signals between the first circuit and the second circuit.
11. A method comprising:
providing a first inductive interface of a first integrated circuit die and a second inductive interface of a second integrated circuit die in alignment with a magnetic communication path included in a substrate by:
axially aligning a third coil of the magnetic communication path with a first coil of the first integrated circuit die; and
axially aligning a fourth coil of the magnetic communication path with a second coil of the first integrated circuit die; and
magnetically communicating signals between a first circuit of the first integrated circuit die and a second circuit of the second integrated circuit die via the first inductive interface and the second inductive interface and via the magnetic communication path.
12. The method of claim 11 further comprising:
bonding the first integrated circuit die to the substrate via a ferromagnetic glue.
13. The method of claim 12 further comprising:
bonding the second integrated circuit die to the substrate via a ferromagnetic glue.
14. The integrated circuit of claim 11 wherein the magnetic communication path includes a ferromagnetic material.
15. The method of claim 11 wherein magnetically communicating signals includes bidirectionally communicating signals between the first circuit and the second circuit.