IP Library Granted Patent US 8,389,873
Granted Patent B2
US 8,389,873 · App. 12/841,125 · Granted Mar 5, 2013

Enclosure of electronic device

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Quick Facts
Patent No.
US 8,389,873
App. No.
12/841,125
Granted
Mar 5, 2013
Kind
B2
Abstract

An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.

Claims (2)

1. An enclosure comprising a plate, wherein the plate defines a plurality of round through holes, a plurality of electromagnetic interference (EMI) shields extend outwards from edges of the corresponding through holes, each through hole comprises a first portion overhung by the shield and a second portion not overhung by the shield, for heat dissipation and anti-EMI; and wherein each shield is substantially shaped as a quarter of spherical surface.

2. An enclosure comprising a plate, wherein the plate defines a plurality of round through holes, a plurality of electromagnetic interference (EMI) shields extend outwards from an outer surface of the plate corresponding to the through holes, each shield extends outwards from a part of an edge of a corresponding through hole and partly overhangs the corresponding through hole; and wherein each shield is substantially shaped as a quarter of spherical surface.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2018
From: HON HAI PRECISION INDUSTRY CO., LTD.
To: CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 045281/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2010
From: HSIEH, PO-CHUAN; PAI, YU-CHANG; LIU, CHIEN-HUNG; HSU, SHOU-KUO
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 024722/0266 →