LED packaging methods and LED-based lighting products
View Patent ↗A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB.
1. A method of packaging a light-emitting diode (LED) chip, comprising:
coupling the LED chip to a printed circuit board (PCB);
forming a conductor on a cover plate;
applying conductive epoxy to at least one of the LED chip and the conductor; and
coupling the cover plate to the PCB such that the conductive epoxy forms one or more circuit connections among the LED chip, the conductor and the PCB.
2. The method of claim 1 , further comprising:
coupling a standoff to the PCB; and
applying conductive epoxy to at least one of the standoff and the conductor,
so that coupling the cover plate to the PCB defines a distance between the PCB and the cover plate.
3. The method of claim 2 , wherein coupling the cover plate to the PCB forms a circuit connection from the PCB, through the standoff, to the conductor.
4. The method of claim 1 , further comprising coupling, to the PCB, one or more circuit components that regulate power supplied to the LED chip.
5. The method of claim 1 , further comprising coupling, to the conductor, one or more circuit components that regulate power supplied to the LED chip.
6. The method of claim 1 , the step of coupling the LED chip to the PCB comprising reflowing solder such that the LED chip aligns to the PCB.
7. The method of claim 1 , further comprising forming a phosphor layer on the cover plate.
8. The method of claim 7 , further comprising selectively forming the phosphor layer on the cover plate, where the cover plate faces the LED chip.
9. The method of claim 7 , further comprising forming a conformal gel over the phosphor layer.
10. The method of claim 1 , further comprising selectively forming a conformal gel with one or more phosphors admixed therein, on the cover plate where the cover plate faces the LED chip, before applying the conductive epoxy.
11. The method of claim 1 , wherein coupling the LED chip comprises soldering the LED chip to the PCB.
12. The method of claim 1 , wherein coupling the LED chip comprises utilizing conductive epoxy to couple the LED chip to the PCB.
13. The method of claim 1 , further comprising filling a space between the PCB and the cover plate with a fill material after coupling the cover plate to the PCB.
14. The method of claim 1 , further comprising forming optics for modifying light passing therethrough, in one of a top surface and a bottom surface of the cover plate.
15. The method of claim 1 , further comprising coupling one or more reflectors to one of the PCB and the cover plate before coupling the cover plate to the PCB, thereby configuring the one or more reflectors to reflect at least one of stray light and light emitted from sides of the LED chips through the cover plate.
16. The method of claim 15 , wherein coupling the cover plate to the PCB comprises utilizing the one or more reflectors to define a distance between the PCB and the cover plate.
17. The method of claim 15 , wherein coupling the cover plate to the PCB comprises forming one or more circuit connections from the PCB to the conductor through the one or more reflectors.
18. The method of claim 15 , wherein coupling the cover plate to the PCB comprises coupling at least one of the one or more reflectors to the other one of the PCB and the cover plate.
19. The method of claim 1 , the steps of applying the conductive epoxy and coupling the cover plate to the PCB preceding the step of coupling the LED chip to the PCB.
20. The method of claim 1 , wherein:
coupling the LED chip comprises coupling a plurality of LED chips to the PCB,
applying comprises applying conductive epoxy to each of the LED chips,
forming comprises forming one or more conductors, and
coupling the cover plate to the PCB comprises concurrently forming circuit connections between each of the LED chips and respective conductors.
21. The method of claim 20 , wherein forming circuit connections comprises forming circuit connections between two or more of the LED chips and a single one of the conductors.
22. The method of claim 20 , wherein forming a conductor comprises forming a plurality of conductors, and fanning circuit connections comprises forming circuit connections between two or more of the LED chips and differing ones of the conductors.