Metal-free supported polycrystalline diamond and method to form

1. A cutting element, comprising:

a substrate; and

a layer of superhard particles sintered to the substrate, the layer including a working surface at a first surface distal from the substrate,

wherein the substrate is non-magnetic and electrically conductive in such that there is substantially free of a recast metal from the substrate after a laser cut wherein the layer of superhard particles has an iron group binder metal, wherein the iron group binder metal infiltrates from the layer of superhard particles into the substrate.

2. The cutting element of claim 1 , wherein the superhard particles are selected from the group of polycrystalline diamond particles or cBN particles.

3. The cutting element of claim 1 , wherein the substrate has a composition including tungsten carbide and an iron group binder metal present in an amount of less than about 0.5 wt-%.

4. The cutting element of claim 3 , wherein the iron group binder metal is present in an amount of greater than zero wt-%.

5. The cutting element of claim 3 , wherein the composition of the substrate is free of binder metal.

6. The cutting element of claim 3 , wherein the composition further includes a metal carbide.

7. A method of forming a cutting element, the method comprising:

positioning a substrate on a first side of a layer of diamond particles;

positioning a catalyst source on a second side of the layer of diamond particles; and

sintering the substrate, the layer of diamond particles and a catalyst source at a pressure greater than 20 kbar and a temperature greater than 1200° C. to form a layer of polycrystalline diamond particles bonded to the substrate,

wherein the substrate is non-magnetic and electrically conductive in such that there is substantially free of a recast metal from the substrate after being sectioned via an ablation technique, wherein the layer of superhard particles has a binder metal, wherein the binder metal infiltrates from the layer of superhard particles into the substrate.

8. The method of claim 7 , wherein the substrate has a composition including tungsten carbide and an iron group binder metal present in an amount of less than about 0.5 wt-%.

9. The method of claim 8 , wherein the iron group binder metal is present in an amount of greater than zero wt-%.

10. The method of claim 8 , wherein the composition of the substrate is free of binder metal.

11. The method of claim 8 , wherein the composition further includes a metal carbide.

12. A method of sectioning a cutting element, the method comprising:

ablating the cutting element to form a reduced shape,

wherein the cutting element includes a substrate and a layer of superhard particles sintered to the substrate, and wherein the substrate is non-magnetic and electrically conductive.

13. The method of claim 12 , wherein the superhard particles are selected from the group of polycrystalline diamond particles and cBN particles.

14. The method of claim 12 , wherein ablating includes laser cutting.

15. The method of claim 14 , wherein there is an absence of recast material from the substrate in the region of the cut.

16. The method of claim 12 , wherein the substrate has a composition including tungsten carbide and an iron group binder metal present in an amount of less than about 0.5 wt-%.

17. The method of claim 16 , wherein the iron group binder metal is present in an amount of greater than zero wt-%.

18. The method of claim 16 , wherein the composition of the substrate is free of binder metal.

19. The method of claim 16 , wherein the composition further includes a metal carbide.