Polycrystalline diamond compact including an at least bi-layer polycrystalline diamond table, methods of manufacturing same, and applications therefor
View Patent ↗In an embodiment, a polycrystalline diamond compact (“PDC”) includes a substrate and a polycrystalline diamond (“PCD”) table bonded to the substrate. The PCD table includes an upper surface. The PCD table includes a first PCD region including bonded-together diamond grains and exhibits a first diamond density. At least a portion of the first PCD region extending inwardly from the working surface is substantially free of metal-solvent catalyst. The PCD table includes an intermediate second PCD region bonded to the substrate, which is disposed between the first PCD region and the substrate. The second PCD region includes bonded-together diamond grains defining interstitial regions, with at least a portion of the interstitial regions including metal-solvent catalyst disposed therein. The second PCD region exhibits a second diamond density that is greater than that of the first diamond density of the first PCD region.
1. A polycrystalline diamond compact, comprising:
a polycrystalline diamond body including an upper cutting surface, the polycrystalline diamond body further including:
a first polycrystalline diamond region comprising bonded-together diamond grains exhibiting a first average grain size, the first polycrystalline diamond region exhibiting a first thermal stability and a first diamond density, the first polycrystalline diamond region extending inwardly from the upper cutting surface; and
a second polycrystalline diamond region disposed adjacent to the first polycrystalline diamond region and defining a lowermost surface spaced from the upper cutting surface, the second polycrystalline diamond region formed partially from one or more sp 2 -carbon-containing additives, the second polycrystalline diamond region comprising bonded-together diamond grains defining interstitial regions and exhibiting a second average grain size greater than the first average grain size of the first polycrystalline diamond region, at least a portion of the interstitial regions including metal-solvent catalyst disposed therein, the second polycrystalline diamond region exhibiting a second thermal stability greater than that of the first thermal stability of the first polycrystalline diamond region and a second diamond density greater than that of the first diamond density of the first polycrystalline diamond region.
2. The polycrystalline diamond compact of claim 1 wherein the second diamond density is about 1 to about 5 percent greater than the first diamond density.
3. The polycrystalline diamond compact of claim 1 wherein the first polycrystalline diamond region exhibits a first thickness and the intermediate second polycrystalline diamond region exhibits a second thickness that is about 1 to about 10 times greater than the first thickness.
4. The polycrystalline diamond compact of claim 1 wherein the first polycrystalline diamond region exhibits a first thickness and the intermediate second polycrystalline diamond region exhibits a second thickness that is about 1 to about 8 times greater than the first thickness.
5. The polycrystalline diamond compact of claim 1 wherein the first polycrystalline diamond region defines a chamfered edge surface of the polycrystalline diamond body.
6. The polycrystalline diamond compact of claim 1 wherein the first polycrystalline diamond region of the polycrystalline diamond body extends inwardly from the upper cutting surface to a depth of about 50 μM to about 200 μm.
7. A rotary drill bit, comprising:
a bit body including a leading end structure configured to facilitate drilling a subterranean formation; and
a plurality of cutting elements mounted to the blades, at least one of the cutting elements including:
a polycrystalline diamond body including an upper cutting surface, the polycrystalline diamond body further including:
a first polycrystalline diamond region comprising bonded-together diamond grains exhibiting a first average grain size, the first polycrystalline diamond region exhibiting a first thermal stability and a first diamond density, the first polycrystalline diamond region extending inwardly from the upper cutting surface; and
a second polycrystalline diamond region disposed adjacent to the first polycrystalline diamond region and defining a lowermost surface spaced from the upper cutting surface, the second polycrystalline diamond region formed partially from one or more sp 2 -carbon-containing additives, the second polycrystalline diamond region comprising bonded-together diamond grains defining interstitial regions and exhibiting a second average grain size greater than the first average grain size of the first polycrystalline diamond region, at least a portion of the interstitial regions including metal-solvent catalyst disposed therein, the second polycrystalline diamond region exhibiting a second thermal stability greater than that of the first thermal stability of the first polycrystalline diamond region and a second diamond density greater than that of the first diamond density of the first polycrystalline diamond region.
8. A polycrystalline diamond compact, comprising:
a substrate; and
a polycrystalline diamond table bonded to the substrate, the polycrystalline diamond table including an upper surface, the polycrystalline diamond table further including,
a first polycrystalline diamond region comprising bonded-together diamond grains exhibiting a first average grain size, the first polycrystalline diamond region exhibiting a first thermal stability and a first diamond density, the first polycrystalline diamond region extending inwardly from the upper surface; and
an intermediate second polycrystalline diamond region bonded to the substrate, the intermediate second polycrystalline diamond region disposed between the first polycrystalline diamond region and the substrate, the intermediate second polycrystalline diamond region formed partially from one or more sp 2 -carbon-containing additives, the intermediate second polycrystalline diamond region comprising bonded-together diamond grains defining interstitial regions and exhibiting a second average grain size greater than the first average grain size of the first polycrystalline diamond region, at least a portion of the interstitial regions including metal-solvent catalyst disposed therein, the intermediate second polycrystalline diamond region exhibiting a second thermal stability that is greater than that of the first thermal stability of the first polycrystalline diamond region and a second diamond density greater than that of the first diamond density of the first polycrystalline diamond region.
9. The polycrystalline diamond compact of claim 8 wherein the second diamond density is about 1 to about 5 percent greater than the first diamond density.
10. The polycrystalline diamond compact of claim 8 wherein the second diamond density is about 5 to about 10 percent greater than the first diamond density.
11. The polycrystalline diamond compact of claim 1 wherein the one or more sp 2 -carbon-containing additives include graphite, graphene, ultra-dispersed diamond particles, fullerenes, or combinations thereof.
12. The polycrystalline diamond compact of claim 8 wherein the one or more sp 2 -carbon-containing additives include graphite, graphene, ultra-dispersed diamond particles, fullerenes, or combinations thereof.
13. The polycrystalline diamond compact of claim 8 wherein the first polycrystalline diamond region exhibits a first thickness and the intermediate second polycrystalline diamond region exhibits a second thickness that is about 1 to about 8 times greater than the first thickness.
14. The polycrystalline diamond compact of claim 8 wherein the first polycrystalline diamond region defines a chamfered edge surface of the polycrystalline diamond table.
15. The polycrystalline diamond compact of claim 8 wherein the substrate includes a cemented carbide substrate.
16. The polycrystalline diamond compact of claim 8 wherein the first polycrystalline diamond region of the polycrystalline diamond table extends inwardly from the upper cutting surface to a depth of about 50 μm to about 200 μm.