IP Library Granted Patent US 8,349,106
Granted Patent B2
US 8,349,106 · App. 12/848,290 · Granted Jan 8, 2013

Adhesive tape joining method and adhesive tape joining apparatus

Assignee: Nitto Denko Corporation
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Quick Facts
Patent No.
US 8,349,106
App. No.
12/848,290
Granted
Jan 8, 2013
Kind
B2
Abstract

A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.

Claims (18)

1. A method of joining an adhesive tape to an adherend, comprising:

a detecting step;

a removing step removing the joint in accordance with detected results; and

a joining step joining the adhesive tape with the joint removed therefrom to the adherend,

the detecting step including:

detecting a joint in the adhesive tape directly by a detector during supplying to the adherend the adhesive tape of a long length in which adhesive tapes of a predetermined length are connected to one another;

transmitting detection signals to a controller that are detected from initiating to terminating of detecting the joint, detecting a length of the joint by the controller, determining an allowable length of the adhesive tape capable of being joined from a joining portion to the joint in accordance with the length of the joint, a length of a transportation path determined in advance corresponding to a distance from a detecting position to a tape joining position of the adhesive tape, and a unit length of the adhesive tape joined to the adherend; and

determining a removal length including the joint backward from the allowable length.

2. The method of joining the adhesive tape according to claim 1 , wherein

the joining step comprises joining of the adhesive tape except the removal portion of the adhesive tape including the joint to the adherend in accordance with the detected results obtained in the detecting step.

3. The method of joining the adhesive tape according to claim 1 , wherein

the joining step comprises joining the adhesive tape to the adherend after pulling out the removal portion of the adhesive tape at the joining position and cutting to remove thereof.

4. The method of joining the adhesive tape according to claim 1 , wherein

the joining step comprises joining the adhesive tape to the adherend after pulling out the removal portion of the adhesive tape at the joining position and winding to collect thereof.

5. The method of joining the adhesive tape according to claim 4 , further comprising the steps of:

joining a front end of the adhesive tape to be removed to a winding drum that moves to the tape joining position;

winding up the adhesive tape by a predetermined length; and

cutting the adhesive tape.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2010
From: MIYAMOTO, SABURO; HASE, YUKITOSHI; YAMAMOTO, MASAYUKI
To: NITTO DENKO CORPORATION
Reel/Frame 024772/0419 →
Priority Claims (1)
JP 2009-200315 · Aug 31, 2009 · national
Continuity (1)
Related Publication 20110048609A1 · Mar 3, 2011