IP Library Granted Patent US 8,376,515
Granted Patent B2
US 8,376,515 · App. 12/850,612 · Granted Feb 19, 2013

Pagewidth printhead assembly incorporating laminated support structure

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Quick Facts
Patent No.
US 8,376,515
App. No.
12/850,612
Granted
Feb 19, 2013
Kind
B2
Abstract

A printhead assembly extending in pagewidth direction includes an elongate support beam; an elongate shell at least partially enclosing and restraining the support beam; and a plurality of printhead integrated circuits mounted to the support beam and substantially aligned with one another in the pagewidth direction. The support beam has formed therein at least one printing fluid reservoir arranged in fluid communication with the plurality of printhead integrated circuits.

Claims (12)

1. A printhead assembly extending in pagewidth direction, the printhead assembly comprising:

an elongate support beam;

an elongate shell at least partially enclosing and restraining the support beam; and

a plurality of printhead integrated circuits mounted to the support beam and substantially aligned with one another in the pagewidth direction, wherein

the support beam has formed therein at least one printing fluid reservoir arranged in fluid communication with the plurality of printhead integrated circuits.

2. A printhead assembly as claimed in claim 1 , wherein the laminated structure has an effective coefficient of thermal expansion substantially equal to that of the plurality of printhead integrated circuits.

3. A pagewidth printhead assembly as claimed in claim 1 , wherein the shell is a laminated structure.

4. A printhead assembly as claimed in claim 3 , wherein the laminated structure has an odd number of laminates arranged so that the outer laminates have the same coefficient of thermal expansion as one another and a different coefficient of thermal expansion to that of the inner laminates.

5. A printhead assembly as claimed in claim 1 , wherein the coefficient of thermal expansion of each laminate is different to that of the printhead integrated circuits.

6. A printhead assembly as claimed in claim 1 , wherein the outer and inner laminates are formed of different metals.

7. A printhead assembly as claimed in claim 5 , wherein the outer laminates are formed of invar.

8. A printhead assembly as claimed in claim 1 , wherein the printhead integrated circuits are fabricated from silicon and constructed using micro-electromechanical techniques.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2013
From: SILVERBROOK RESEARCH PTY. LIMITED
To: ZAMTEC LIMITED
Reel/Frame 030169/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2010
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 024791/0205 →