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App. No. 12/852,467 · Confirmation No. 3968

STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

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Quick Facts
App. No.
12/852,467
Filed
2010-08-07
Pub. No.
US20110024905A1
Art Unit
2891