PRINTHEAD ASSEMBLY WITH A PLURALITY OF PRINTHEAD INTEGRATED CIRCUITS EACH WITH A STACK OF INK DISTRIBUTION LAYERS

1 . A printhead assembly comprising:

a plurality of printhead integrated circuits (ICs) each with ink ejection nozzles;

a tape automated bonding (TAB) film connected to the printhead IC's,

a controller in signal connection with each of the printhead ICs via the TAB film; and,

ink distribution layers laminated together and secured to each of the printhead ICs respectively, each layer defining apertures that coincide with the apertures in adjacent layer to provide ink distribution channels.

2 . The printhead assembly of claim 1 , wherein the ink ejection nozzles are spaced for printing with a resolution of 1600 dots per inch, and each said printhead IC also configured to eject 6 different colors or types of ink.

3 . The printhead assembly of claim 1 , wherein the stack of ink distribution layers includes a top layer sheet, an upper layer sheet, a mid layer sheet and a lower sheet.

4 . The printhead assembly of claim 3 , wherein the upper layer sheet is manufactured from stainless steel with the printhead IC bonded thereto.

5 . The printhead assembly of claim 3 , wherein the stack of ink distribution layers includes air channels for directing air at the nozzles to purge ink from said nozzles.

6 . The printhead assembly of claim 5 , wherein the top layer sheet is configured to direct air at a side of the printhead IC mounted on the upper layer sheet.

7 . The printhead assembly of claim 1 , wherein the IC is bonded by wires onto a PCB film, the wires being encapsulated in an epoxy.