IP Library Granted Patent US 8,128,418
Granted Patent B1
US 8,128,418 · App. 12/857,965 · Granted Mar 6, 2012

Thermal expansion compensator having an elastic conductive element bonded to two facing surfaces

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Quick Facts
Patent No.
US 8,128,418
App. No.
12/857,965
Granted
Mar 6, 2012
Kind
B1
Abstract

A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.

Claims (31)

1. A thermal expansion compensator, comprising:

a first electrode structure having a first surface;

a second electrode structure having a second surface facing the first surface; and

an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate,

the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.

2. A thermal expansion compensator, comprising:

a first electrode structure having a first surface;

a second electrode structure having a second surface facing the first surface; and

a series of coils arranged side-by-side and between the first and second electrode structures with respective portions of each of the coils metallurgically bonded to corresponding portions of the first and second surfaces.

3. The thermal expansion compensator according to claim 2 , wherein the coils comprise helical coiling.

4. The thermal expansion compensator according to claim 2 , wherein the coils are separate from one another.

5. The thermal expansion compensator according to claim 2 , wherein the coils comprise wires having relatively small diameters relative to a distance between the first and second electrode structures.

6. The thermal expansion compensator according to claim 2 , wherein the first and second electrode structures comprise molybdenum (Mo).

7. The thermal expansion compensator according to claim 6 , wherein the first and second electrode structures further comprise titanium (Ti).

8. The thermal expansion compensator according to claim 7 , wherein the coils comprise wiring formed of molybdenum (Mo).

9. A thermal expansion compensator, comprising:

a first electrode structure having a first surface;

a second electrode structure having a second surface facing the first surface; and

wiring, including two or more wire sections, each of which is coiled to form a coil section having opposing ends corresponding to opposing wire section ends and sides extending therebetween,

each of the coil sections being disposed sidelong between the first and second electrode structures with respective portions of each of the coil section sides metallurgically bonded to corresponding portions of the first and second surfaces.

10. The thermal expansion compensator according to claim 9 , wherein the coil sections comprise helical coiling.

11. The thermal expansion compensator according to claim 9 , wherein the coil sections are separate from one another.

12. The thermal expansion compensator according to claim 9 , wherein the wire sections have a relatively small diameter relative to a distance between the first and second electrode structures.

13. The thermal expansion compensator according to claim 9 , wherein the first and second electrode structures comprise molybdenum (Mo).

14. The thermal expansion compensator according to claim 13 , wherein the first and second electrode structures comprise titanium (Ti).

15. The thermal expansion compensator according to claim 14 , wherein the wiring comprises molybdenum (Mo).

16. A thermal expansion compensator, comprising:

a first electrode structure having a first surface;

a second electrode structure having a second surface facing the first surface; and

wiring, including two or more wire sections, each of which is coiled to form a coil section having opposing ends corresponding to opposing wire section ends and sides extending therebetween,

each of the coil sections being disposed between the first and second electrode structures such that longitudinal axes thereof are substantially parallel with respective planes of the first and second surfaces with respective portions of each of the coil section sides metallurgically bonded to corresponding portions of the first and second surfaces.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Aug 5, 2016
From: U.S. BANK NATIONAL ASSOCIATION
To: AEROJET ROCKETDYNE OF DE, INC. (F/K/A PRATT & WHITNEY ROCKETDYNE, INC.)
Reel/Frame 039597/0890 →
CHANGE OF NAME Recorded May 8, 2014
From: PRATT & WHITNEY ROCKETDYNE, INC.
To: AEROJET ROCKETDYNE OF DE, INC.
Reel/Frame 032845/0909 →
SECURITY AGREEMENT Recorded Jun 21, 2013
From: PRATT & WHITNEY ROCKETDYNE, INC.
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 030656/0615 →
SECURITY AGREEMENT Recorded Jun 17, 2013
From: PRATT & WHITNEY ROCKETDYNE, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 030628/0408 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2012
From: HAMILTON SUNDSTRAND CORPORATION
To: PRATT & WHITNEY, ROCKETDYNE, INC.
Reel/Frame 029293/0682 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2011
From: HAMILTON SUNDSTRAND CORPORATION
To: HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC.
Reel/Frame 026490/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2010
From: DETERMAN, WILLIAM; MATEJCZYK, DANIEL EDWARD
To: HAMILTON SUNDSTRAND CORPORATION
Reel/Frame 024847/0287 →