IP Library Patent Application 12859206
Patent Application
App. No. 12/859,206

EJECTION NOZZLE ARRANGEMENT

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Quick Facts
Patent No.
US None
App. No.
12/859,206
Abstract

An ejection nozzle arrangement having a substrate, a fluid port in the substrate, a chamber on the substrate so as to have the fluid port therein, a roof on the chamber having an ejection port, and an arm extending through an opening in the chamber into the chamber for causing ejection of fluid within the chamber from the ejection port. The arm is suspended within the opening so that the arm is spaced from both the substrate and the chamber within the opening.

Claims (10)

1 . An ejection nozzle arrangement comprising:

a substrate;

a chamber on the substrate;

a roof on the chamber having an ejection port; and

an arm extending through an opening in the chamber into the chamber for causing ejection of fluid within the chamber from the ejection port, the arm being suspended within the opening so that the arm is spaced from both the substrate and the chamber within the opening.

2 . A nozzle arrangement according to claim 1 , further comprising a layer of passivation material on the substrate, the chamber being arranged on the passivation layer.

3 . A nozzle arrangement according to claim 2 , wherein the passivation material is silicone.

4 . A nozzle arrangement according to claim 1 , wherein the fluid is ink.

5 . A nozzle arrangement according to claim 4 , wherein the nozzle arrangement forms part of an inkjet printhead integrated circuit.

6 . A nozzle arrangement according to claim 1 , wherein the arm includes a heating circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2010
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
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