Method of making a floor panel
View Patent ↗A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.
1. A method of making a floor panel, comprising:
providing an adhesive on a release member;
laminating or marrying the release member to a rigid bottom layer of the floor panel such that the adhesive is between the release member and the rigid bottom layer, the rigid bottom layer having a first length and a first width;
removing a first portion of the release member to expose an area of the adhesive; and
adhering a top layer of the floor panel to the area such that the top layer is offset with respect to the rigid bottom layer in a direction of length and width and a marginal end portion of a top surface of the rigid bottom layer and a marginal end portion of the bottom surface of the top layer is exposed, the top layer having a top surface with a visible decorative pattern, the top layer having a second length and a second width, the second length of the top layer being substantially the same as the first length of the rigid bottom layer and the second width of the top layer being substantially the same as the first width of the rigid bottom layer, wherein a ratio of a thickness of the top layer to a thickness of the rigid bottom layer is about 5 or greater.
2. The method of claim 1 , wherein the marginal end portions are substantially L-shaped.
3. The method of claim 1 , further comprising heat aging the adhesive for about 24 hours at 145 degrees Fahrenheit.
4. The method of claim 1 , wherein a second portion of the release member remains on the marginal end portion of the top surface of the rigid bottom layer.
5. The method of claim 1 , wherein the top layer is a flexible sheet material comprising plastic, vinyl, polyvinyl chloride, or polyester.
6. The method of claim 1 , further comprising applying pressure to the top layer or the rigid bottom layer to further bond the top layer and the bottom layer.
7. The method of claim 1 , wherein after the portion of the release member is removed to expose the area of the adhesive a substantially L-shaped portion of the release member remains laminated or married to the rigid bottom layer.
8. The method of claim 1 , wherein the rigid bottom layer comprises plastic, vinyl, polyvinyl chloride, polyester, polyolefin, or nylon.
9. The method of claim 1 , wherein the rigid bottom layer has a thickness less than a thickness of the top layer.
10. The method of claim 1 , wherein the laminated or married release member and the rigid bottom layer form a continuous sheet.
11. The method of claim 10 , further comprising slitting the continuous sheet into strips.
12. The method of claim 11 , wherein the continuous sheet is slit substantially parallel to a direction of tension of the rigid bottom layer to form the strips, each of the strips having a length longer than a width thereof, the direction of tension being substantially perpendicular to the width of the strips.
13. The method of claim 11 , wherein the continuous sheet is slit substantially perpendicular to a direction of tension of the rigid bottom layer to form the strips, each of the strips having a length longer than a width thereof, the direction of tension being substantially parallel to the width of the strips.
14. The method of claim 11 , further comprising inserting at least one of the strips into a stripping jig.
15. The method of claim 14 , further comprising cutting the release member with a cutting edge of the stripping jig while removing the portion of the release member.
16. The method of claim 11 , further comprising positioning the strip having the exposed area of the adhesive into an assembly jig.
17. The method of claim 16 , further comprising positioning the top layer in a stepped portion of the assembly jig while adhering the top layer to the area such that the top layer is offset with respect to the bottom layer.
18. The method of claim 1 , wherein the ratio of the thickness of the top layer to the thickness of the rigid bottom layer is about 10-100.
19. The method of claim 18 , wherein the ratio of the thickness of the top layer to the thickness of the rigid bottom layer is about 10-25.
20. The method of claim 1 , further comprising annealing the rigid bottom layer.