Optical transceiver assembly
View Patent ↗Techniques are disclosed that allow an optical transceiver module to be secured to a surface. In one example, an optical transceiver assembly includes an optical transceiver module, and a compressible support clip configured to engage the optical transceiver module, the support clip configured to receive at least a portion of a surface defining an aperture in order to at least partially support the optical transceiver module within the aperture.
1. An optical transceiver assembly comprising:
an optical transceiver module; and
a compressible support clip configured to engage the optical transceiver module, the support clip configured to receive at least a portion of a surface defining an aperture in order to at least partially support the optical transceiver module within the aperture.
2. The assembly of claim 1 , wherein the surface is a printed circuit board.
3. The assembly of claim 2 , wherein the printed circuit board forms a part of an optical network component.
4. The assembly of claim 1 , wherein the compressible support clip comprises:
a first side defining a first support clip aperture;
a second side substantially opposite the first side, the second side defining a second support clip aperture; and
a third side that joins the first side and the second side, the third side defining a third support clip aperture,
wherein each of the second support clip aperture, the third support clip aperture, and
the fourth support clip aperture are configured to receive a respective portion of the optical transceiver module.
5. The assembly of claim 4 , wherein at least a portion of the support clip is configured to apply a positive force to at least a portion of the surface defining the aperture.
6. The assembly of claim 5 , wherein the at least a portion of the support clip that is configured to apply a positive force to a surface defining a surface aperture comprises the first side and the second side.
7. The assembly of claim 4 ,
wherein the first side defines a first notch, the first notch configured to receive a first portion of the at least a portion of the surface defining the aperture,
wherein the second side defines a second notch, the second notch configured to receive a second portion of the at least a portion of the surface defining the aperture, and
wherein the third side defines a third tab and a fourth tab, the third tab and the fourth tab configured to engage a top side of the surface.
8. The assembly of claim 7 , wherein the third tab and the fourth tab are configured to be soldered to the surface.
9. The assembly of claim 1 , wherein at least a portion of the support clip is constructed of a conductive material.
10. The assembly of claim 1 , wherein the optical transceiver module is either a diplexer or a triplexer.
11. A method comprising:
combining an optical transceiver module and a support clip to form a combination;
applying pressure to the support clip; and
inserting the combination into a surface aperture defined by a surface.
12. The method of claim 11 , wherein combining an optical transceiver module and a support clip comprises:
inserting a first portion of the optical transceiver module into a first support clip aperture defined by the support clip.
13. The method of claim 11 , wherein applying pressure to the support clip comprises:
applying pressure to a first side of the support clip and a second side of the support clip, the second side being substantially opposite the first side.
14. The method of claim 11 , wherein the surface defines the entire surface aperture.
15. The method of claim 11 , wherein the surface is a printed circuit board.
16. The method of claim 11 , wherein inserting the combination into an aperture defined by a surface comprises:
inserting a first portion of the surface defining the surface aperture into a first notch defined by a first side of the support clip; and
inserting a second portion of the surface defining the surface aperture into a second notch defined by a second side of the support clip, the second side being substantially opposite the first side.
17. The method of claim 11 , further comprising:
soldering a portion of the support clip to the surface.
18. The method of claim 11 , wherein the portion is at least one of a first tab and a second tab, wherein the first tab is defined by a first side of the support clip, and wherein the second tab is defined by a second side of the support clip.
19. The method of claim 11 , wherein the optical transceiver module comprises a plurality of leads, the method further comprising:
soldering at least some of the plurality of leads to the surface.
20. An optical transceiver assembly comprising:
an optical transceiver module comprising a plurality of leads; and
a compressible support clip configured to engage the optical transceiver module, the support clip configured to receive at least a portion of a surface defining an aperture in order to at least partially support the optical transceiver module within the aperture, wherein the support clip comprises:
a first side defining a first support clip aperture and a first notch, the first notch configured to receive a first portion of the at least a portion of the surface defining the aperture;
a second side substantially opposite the first side, the second side defining a second support clip aperture and a second notch, the second notch configured to receive a second portion of the at least a portion of the surface defining the aperture;
and
a third side that joins the first side and the second side, the third side defining a third support clip aperture, a third tab, and a fourth tab, the third tab and the fourth tab configured to engage a top side of the surface,
wherein each of the second support clip aperture, the third support clip aperture, and the fourth support clip aperture are configured to receive a respective portion of the optical transceiver module,
wherein at least a portion of the support clip is constructed of a conductive material, and
wherein the plurality of leads are configured to be soldered to either the top of the surface or a bottom of the surface.