Method for producing an electric component
View Patent ↗A method for producing an electric component including a dielectric layer on a substrate, includes the method steps of applying a metallic layer to the substrate and oxidizing the metallic layer to form a dielectric layer, wherein at least one partial region of the metallic layer is fully oxidized through the entire thickness of the layer.
1. A method for producing an electric component, the method comprising:
providing a substrate for an electroacoustic component;
forming an electrically conductive layer over the substrate;
structuring the electrically conductive layer;
forming an electrically nonconductive layer over the structured electrically conductive layer;
forming a base metallization over the electrically nonconductive layer;
thickening the base metallization using an electrolytic process thereby forming a metallic layer; and
oxidizing at least portions of the metallic layer thereby forming a dielectric layer.
2. The method as claimed in claim 1 , wherein the metallic layer comprises at least 90% Al.
3. The method as claimed in claim 1 , wherein the substrate comprises a piezoelectric material.
4. The method as claimed in claim 1 , further comprising applying a resist to regions of the electrically nonconductive layer prior to forming the base metallization.
5. The method as claimed in claim 1 , further comprising structuring the electrically nonconductive layer after oxidizing the metallic layer.
6. The method as claimed in claim 1 , further comprising applying a resist to a surface after oxidizing the metallic layer.
7. The method as claimed in claim 6 , further comprising forming a contact layer to the surface after applying the resist.
8. The method as claimed in claim 7 , further comprising removing the resist and the contact layer deposited thereon.
9. The method as claimed in claim 1 , further comprising:
structuring the electrically nonconductive layer after oxidizing the metallic layer; and
applying a resist to a surface after structuring the electrically nonconductive layer.
10. The method as claimed in claim 1 , further comprising depositing an electrically insulating covering layer on a surface.
11. The method as claimed in claim 1 , further comprising structuring the electrically nonconductive layer before applying the base metallization.
12. The method as claimed in claim 1 , further comprising applying a resist to partial regions of the metallic layer before oxidizing the metallic layer.
13. The method as claimed in claim 12 , further comprising etching the metallic layer after applying the resist.
14. The method as claimed in claim 1 , further comprising applying an oxidation resist to the metallic layer.
15. The method as claimed in claim 14 , wherein the metallic layer is selectively oxidized after applying the oxidation resist.
16. The method as claimed in claim 15 , further comprising:
removing the oxidation resist;
applying a resist;
depositing a contact layer on a surface;
removing the resist with the contact layer deposited thereon; and
applying an electrically insulating covering layer.
17. The method as claimed in claim 15 , further comprising:
removing the oxidation resist; and
forming a contact layer over a region uncovered by the removal of the oxidation resist.
18. The method as claimed in claim 17 , wherein the component is connectable to a circuit board via the contact layer.
19. The method as claimed in claim 17 , wherein the component is connected to a further component via regions of the contact layer.
20. The method as claimed in claim 1 , wherein a portion of a surface of the substrate that lies opposite a surface that was coated with the electrically conductive layer is removed after oxidizing the metallic layer, such that the substrate has the same thickness as the dielectric layer.