Structure of AC light-emitting diode dies

1. An arrangement of light emitting diodes, comprising:

a substrate; and

four adjoining light-emitting units forming a light-emitting array on said substrate, each unit comprising at least one micro-die, each micro-die comprising:

a lower semiconductor layer of first conductivity on said substrate;

an upper semiconductor layer of second conductivity opposite to the first conductivity on said lower semiconductor layer;

a first connecting portion disposed on the lower semiconductor layer; and

a second connecting portion disposed on the upper semiconductor layer,

wherein the first connecting portion and the second connecting portion are respectively located near different sides of the micro-die, and

wherein the four adjoining light-emitting units comprise a first group of the connecting portions comprising four connecting portions disposed substantially at a center of the light-emitting array, and a second group of the connecting portions comprising another four connecting portions disposed substantially at the periphery of the light-emitting array.

2. The arrangement of claim 1 , wherein each of the four adjoining light-emitting unit comprises two micro-dies connected in anti-parallel.

3. The arrangement of claim 1 , wherein the connecting portion is a cathode or an anode of the micro-die.

4. The arrangement of claim 1 , wherein the two connecting portions in each micro-die is disposed on opposite corners of the micro-die.

5. The arrangement of claim 1 , wherein the shape of the light-emitting array is substantially rectangular.

6. The arrangement of claim 1 , further comprising two bonding pads disposed at two opposite ends of the substrate.

7. The arrangement of claim 6 , wherein the four adjoining light-emitting units are connected serially between the two bonding pads.

8. An arrangement of light emitting diodes, comprising:

a first micro-die comprising a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end;

a second micro-die

a first bridge covering the first connecting portion, and electrically connecting the first micro-die with the second micro-die;

a second bridge covering the second connecting portion, and electrically connecting the first micro-die with the second micro-die; and

a substrate supporting the first micro-die and the second micro die.

9. The arrangement of claim 8 , further comprising a bonding pad disposed around a corner of the substrate.

10. The arrangement of claim 8 , wherein the first bridge or the second bridge is substantially elongated along a line not parallel to the first edge.

11. The arrangement of claim 8 , wherein the second micro-die comprises a fourth edge substantially parallel to the second edge.

12. The arrangement of claim 8 , wherein the second micro-die comprises a third edge being substantially parallel to the first edge and having two ends.

13. The arrangement of claim 12 , wherein the second micro-die comprises a third connecting portion near one of the two ends, and a fourth connecting portion near the other of the two ends.