Apparatuses and methods for removal of ink buildup

1. A substrate patterning method comprising:

spraying ink on a surface of a substrate, the spraying of the ink resulting in an overspray of excess ink past an edge of the substrate;

changing a temperature of the excess ink to cause a change in a viscosity of the excess ink; and

removing the excess ink having the changed viscosity;

wherein the changing of the temperature of the excess ink causes a phase of the excess ink to change from a first phase to a second phase that is different from the first phase; wherein the changing of the temperature comprises heating the excess ink above room temperature; and wherein a first phase of the excess ink is a solid phase and wherein a second phase of the excess ink is a liquid phase, wherein the heating of the excess ink causes the solid phase to change to the liquid phase; and wherein the removal of the overspray comprises applying a vacuum to the excess ink.

2. The substrate patterning method of claim 1 , wherein the changing of the temperature of the excess ink comprises cooling the excess ink.

3. The substrate patterning method of claim 2 , wherein a first phase of the excess ink is a liquid phase and a second phase of the excess ink is a solid phase, and wherein the cooling of the excess ink causes the liquid phase to change to the solid phase.

4. The substrate patterning method of claim 3 , wherein the excess ink is changed to the solid phase in midair.

5. The substrate patterning method of claim 1 , wherein the removal of the overspray comprises applying a current of air to the excess ink.

6. The substrate patterning method of claim 1 , wherein the ink comprises wax that is used as a masking material in at least one of an etching process or an electroplating process.