IP Library Granted Patent US 9,057,146
Granted Patent B2
US 9,057,146 · App. 12/862,187 · Granted Jun 16, 2015

Eddy current thickness measurement apparatus

Inventors: Gary J. Rosen (Manchester, MA); Frank Sinclair (Quincy, MA); Alexander Soskov (Danvers, MA); James S. Buff (Brookline, NH)
Assignee: Varian Semiconductor Equipment Associates, Inc.
C30B11/00C30B29/64C30B29/08C30B29/406C30B29/36Y10T117/1088Y10T117/1068Y10T117/1044Y10T117/1032Y10T117/1048Y10T117/1004Y10T117/1008B22D11/1206B22D11/143C30B15/00C30B29/06C30B35/00G01B7/105G01B7/107
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Quick Facts
Patent No.
US 9,057,146
App. No.
12/862,187
Granted
Jun 16, 2015
Kind
B2
Abstract

A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt.

Claims (33)

1. A sheet-forming apparatus comprising:

a melt of a material;

a sheet of said material disposed in said melt, wherein said sheet has a higher resistivity than said melt;

a cooling plate disposed a distance above a surface of said melt that is configured to form said sheet;

an eddy current measurement system for providing real-time monitoring and feedback of a thickness of said sheet as it is formed in said melt, the eddy current measurement system comprising:

an exciting coil and a sensing coil disposed a second distance above said surface of said melt downstream of said cooling plate; and

a power source connected to said exciting coil; and

a controller connected to said eddy current measurement system, said controller programmed to execute instructions to increase a temperature of said cooling plate if said sheet is thicker than desired and to decrease a temperature of said cooling plate if said sheet is thinner than desired.

2. The sheet-forming apparatus of claim 1 , wherein said sheet floats on said melt.

3. The sheet-forming apparatus of claim 1 , wherein said material is silicon.

4. The sheet-forming apparatus of claim 1 , further comprising a quartz sleeve disposed around said exciting coil and said sensing coil.

5. The sheet-forming apparatus of claim 1 , wherein said exciting coil and said sensing coil are composed of copper or molybdenum.

6. The sheet-forming apparatus of claim 1 , further comprising a vessel configured to contain said melt and a spillway configured to separate said sheet from said melt.

7. The sheet-forming apparatus of claim 1 , further comprising a pump configured to make said sheet and a surface of said melt flow at an equal speed.

8. The sheet-forming apparatus of claim 1 , wherein said power source is configured to energize said exciting coil to produce a time-varying magnetic field.

9. The sheet-forming apparatus of claim 1 , wherein said controller is configured to measure an induced magnetic field in said sensing coil, wherein said controller interprets a signal from said sensing coil to estimate a thickness of a higher resistivity layer disposed on top of a lower resistivity layer.

10. The sheet-forming apparatus of claim 1 , wherein said exciting coil and said sensing coil are contained within a single coil.

11. The sheet-forming apparatus of claim 1 , wherein one of said exciting coil and said sensing coil has a diameter, and wherein said second distance is less than said diameter.

12. The sheet-forming apparatus of claim 1 , wherein said cooling plate is configured to use radiation cooling.

13. A sheet-forming apparatus comprising:

a melt of a material;

a sheet of said material that floats on said melt, wherein said sheet has a higher resistivity than said melt;

a cooling plate disposed a distance above a surface of said melt that is configured to form said sheet, wherein said cooling plate is configured to use radiation cooling;

a pump configured to make said sheet and said melt flow; and

an eddy current measurement system configured for real-time monitoring and feedback of a thickness of said sheet as it is formed on said melt, the eddy current measurement system comprising:

an exciting coil and a sensing coil disposed a second distance above said surface of said melt downstream of said cooling plate and; and

a power source connected to said exciting coil; and

a controller connected to said eddy current measurement system, said controller programmed to execute instructions to increase a speed of said melt if said sheet is thicker than desired and to decrease a speed of said melt if said sheet is thinner than desired.

14. The sheet-forming apparatus of claim 13 , wherein said material is silicon.

15. The sheet-forming apparatus of claim 13 , further comprising a quartz sleeve disposed around said exciting coil and said sensing coil.

16. The sheet-forming apparatus of claim 13 , wherein said controller is configured to measure an induced magnetic field in said sensing coil, wherein said controller interprets a signal from said sensing coil to estimate a thickness of a higher resistivity layer disposed on top of a lower resistivity layer.

17. The sheet-forming apparatus of claim 13 , wherein one of said exciting coil and said sensing coil has a diameter, and wherein said second distance is less than said diameter.

18. The sheet-forming apparatus of claim 13 , wherein said power source is configured to energize said exciting coil to produce a time-varying magnetic field.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2025
From: BLUE ORIGIN, LLC
To: BLUE ORIGIN MANUFACTURING, LLC
Reel/Frame 070585/0314 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2024
From: LEADING EDGE EQUIPMENT TECHNOLOGIES, INC.
To: BLUE ORIGIN, LLC
Reel/Frame 068601/0041 →
CHANGE OF NAME Recorded Dec 1, 2021
From: LEADING EDGE CRYSTAL TECHNOLOGIES, INC.
To: LEADING EDGE EQUIPMENT TECHNOLOGIES, INC.
Reel/Frame 058292/0241 →
ACQUISITION Recorded Jan 15, 2020
From: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
To: APPLIED MATERIALS, INC.
Reel/Frame 051973/0106 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2019
From: APPLIED MATERIALS, INC.
To: LEADING EDGE CRYSTAL TECHNOLOGIES, INC.
Reel/Frame 051247/0716 →
CONFIRMATORY LICENSE Recorded Apr 16, 2013
From: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 030220/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2010
From: ROSEN, GARY J.; SINCLAIR, FRANK; SOSKOV, ALEXANDER; BUFF, JAMES S.
To: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
Reel/Frame 024878/0291 →
Continuity (1)
Related Publication 20120048496A1 · Mar 1, 2012