IP Library Granted Patent US 8,351,204
Granted Patent B2
US 8,351,204 · App. 12/864,230 · Granted Jan 8, 2013

Modular data processing components and systems

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,351,204
App. No.
12/864,230
Granted
Jan 8, 2013
Kind
B2
Abstract

Data processing modules including a housing and optical interfaces associated with the exterior of the housing, and systems including the same.

Claims (33)

1. A data processing module, comprising: a housing defining an exterior; at least one circuit board including at least one electronic component located within the housing; at least first and second optical interfaces associated with the exterior of the housing and operably connected to the at least one electronic component, and first and second slidable covers associated with the exterior of the housing and movable between covered positions where the first and second slidable covers respectively cover the first and second optical interfaces and uncovered positions where the first and second slidable covers respectively do not cover the first and second optical interfaces, wherein the first and second slidable covers are to be engaged by inwardly extending protrusions of a receptacle to move the first and second slidable covers from the covered position to the uncovered position.

2. A data processing module as claimed in claim 1 , wherein

the housing includes at least first and second air flow openings associated with opposite ends of the housing.

3. A data processing module as claimed in claim 1 , wherein the housing includes a front end defining a front end height and a rear end defining a rear end height that is less than the front end height.

4. A modular data processing system, comprising:

an enclosure including a plurality of receptacles; and

at least first and second data processing modules, each of the first and second data processing modules including:

a housing defining an exterior;

at least one circuit board including at least one electronic component located within the housing; and

at least first and second optical interfaces associated with the exterior of the housing and operably connected to the at least one electronic component, wherein:

the enclosure receptacles and each of the data processing modules are respectively configured such that one data processing module optical interface will be aligned with, and in close proximity to, another data processing module optical interface when the data processing modules are inserted into adjacent enclosure receptacles; and

the receptacles each include first and second openings located such that the first and second optical interfaces of each data processing module will be aligned with the first and second openings when the data processing modules are inserted into enclosure receptacles.

5. A modular data processing system as claimed in claim 4 , wherein there is a free space between the first and second openings.

6. A modular data processing system as claimed in claim 4 , wherein there is an optical coupling apparatus associated with the first and second openings.

7. A modular data processing system as claimed in claim 4 , wherein:

the enclosure receptacles include a front end defining a front end height and a rear end defining a rear end height that is less than the front end height; and

the housing includes a front end defining the front end height and a rear end defining the rear end height.

8. A modular data processing system as claimed in claim 4 , wherein:

the housing of each of the data processing modules includes at least first and second openings associated with opposite ends of the housing; and

the enclosure includes a blower configured to create air flow from the first opening to the second opening of each housing.

9. A modular data processing system, comprising:

an enclosure including a plurality of receptacles; and

at least first and second data processing modules, each of the first and second data processing modules including:

a housing defining an exterior;

at least one circuit board including at least one electronic component located within the housing; and

at least first and second optical interfaces associated with the exterior of the housing and operably connected to the at least one electronic component, wherein:

the enclosure receptacles and each of the data processing modules are respectively configured such that one data processing module optical interface will be aligned with, and in close proximity to, another data processing module optical interface when the data processing modules are inserted into adjacent enclosure receptacles;

each data processing module includes first and second slidable covers associated with the exterior of the housing and movable between covered positions where the first and second slidable covers cover the first and second optical interfaces and uncovered positions where the first and second slidable covers do not cover the first and second optical interfaces; and

each enclosure receptacle includes first and second slots configured to receive the first and second slidable covers.

10. A modular data processing system as claimed in claim 9 , wherein each enclosure receptacle includes first and second inwardly extending protrusions configured to engage the first and second slidable covers as the data processing module slides into the enclosure receptacle.

11. A modular data processing system as claimed in claim 9 , wherein:

the housing of each of the data processing modules include at least first and second openings associated with opposite ends of the housing; and

the enclosure includes a blower configured to create air flow from the first opening to the second opening of each housing.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2022
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 059058/0720 →
PATENT ASSIGNMENT, SECURITY INTEREST, AND LIEN AGREEMENT Recorded Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2010
From: YEO, JONG-SOUK; WILLIAMS, R. STANLEY; PATEL, CHANDRAKANT D.; STEWART, DUNCAN R.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 025501/0558 →