Thermally conductive silicone grease composition
View Patent ↗A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R 1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R 2 —SiR 1 a(OR 3 ) (3-a) (wherein R 1 designates the previously mentioned groups; R 2 designates oxygen atoms or alkylene groups; R 3 designates alkyl groups; and ‘a’ is an integer ranging from 0 to 2); and ‘m’ and ‘n’ are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.
1. A thermally conductive silicone grease composition comprising at least the following components:
100 parts by mass of (A) a dimethylpolysiloxane capped at both terminals with dimethylvinylsiloxy groups or a copolymer of a dimethylsiloxane and a methylphenylsiloxane capped at both molecular terminals with dimethylvinylsiloxy groups and having a viscosity in the range of 10 to 50,000 mPa·s at 25° C.;
400 to 3,500 parts by mass of spherical aluminum oxide (B); and
1 to 100 parts by mass of an organopolysiloxane (C) having silicon-bonded hydrogen atoms at both molecular terminals and in the molecular chains and having a viscosity in the range of 10 to 50,000 mPa·s at 25° C.
2. The thermally conductive silicone grease composition according to claim 1 , wherein component (B) has an average particle size ranging from 0.01 to 100 μm.
3. The thermally conductive silicone grease composition according to claim 1 , wherein component (C) is an organopolysiloxane of the following general formula:
(wherein R 4 designates identical or different univalent hydrocarbon groups, which are free of unsaturated aliphatic bonds; “p” is an integer equal to or greater than 0; and “q” is an integer equal to or greater than 1).
4. The thermally conductive silicone grease composition according to claim 1 , further containing a silica-based filler (D) in an amount of 1 to 100 parts by mass for 100 parts by mass of component (A).
5. The thermally conductive silicone grease composition according to claim 1 , further containing a coupling agent (E) in an amount of 0.1 to 10 parts by mass for 100 parts by mass of component (A).