Microphone unit
View Patent ↗To provide a downsized microphone unit in which a differential microphone is densely mounted thereon. The microphone unit has a cover portion 30 and a microphone substrate 10 , in which a first substrate internal space 15 is communicated with a cover portion internal space 32 via a first substrate opening 11 and a cover portion opening 31 , and is communicated with the outside via a second substrate opening 12 , a second substrate internal space 16 is communicated with the cover portion internal space 32 via a third substrate opening 13 and a cover portion opening 31 , and is communicated with the outside via a fourth substrate opening 14 , a partition portion 20 covers a communication aperture between the first substrate opening 11 and the cover portion opening 31 , and a diaphragm 22 covers at least a part of the communication aperture between the first substrate opening 11 and the cover portion opening 31.
1. A microphone unit comprising:
a microphone substrate;
a partition portion including a diaphragm; and
a cover portion which covers one surface side of the microphone substrate, wherein:
the cover portion has a cover portion opening provided in one surface, and a cover portion internal space communicating with an outside of the cover portion via the cover portion opening,
the microphone substrate has a first substrate opening and a third substrate opening which are provided in one surface, a second substrate opening and a fourth substrate opening which are provided in the other surface, and a first substrate internal space and a second substrate internal space,
the first substrate internal space is communicated with the cover portion internal space via the first substrate opening and the cover portion opening, and is communicated with an outside of the microphone unit via the second substrate opening,
the second substrate internal space is communicated with the cover portion internal space via the third substrate opening and the cover portion opening, and is communicated with the outside of the microphone unit via the fourth substrate opening,
the partition portion covers a communication aperture between the first substrate opening and the cover portion opening, and
the diaphragm covers at least a part of the communication aperture between the first substrate opening and the cover portion opening.
2. The microphone unit according to claim 1 , wherein the cover portion internal space is provided in a direction vertical to a surface plane of the cover portion opening.
3. The microphone unit according to claim 1 , wherein the first substrate internal space is provided in a direction vertical to a surface plane of the first substrate opening.
4. The microphone unit according to claim 1 , wherein the first substrate internal space is provided in a direction vertical to a surface plane of the second substrate opening.
5. The microphone unit according to claim 1 , wherein:
the first substrate internal space is provided at a position at which the first substrate internal space in not overlapped with a direction vertical to a surface plane of the second substrate opening, and
the second substrate opening is provided at a position at which the second substrate opening is not overlapped with a direction vertical to a surface plane of the first substrate opening.
6. The microphone unit according to claim 1 , further comprising a signal processing circuit disposed on one surface side of the microphone substrate inside the cover portion internal space.
7. The microphone unit according to claim 6 , further comprising an electrode unit electrically connected to the signal processing circuit on the other surface side of the microphone substrate.
8. The microphone unit according to claim 1 , wherein a route length of a sound wave from the second substrate opening to the diaphragm and a route length of a sound wave from the fourth substrate opening to the diaphragm is equal such that a sound wave arrival time from the second substrate opening to the diaphragm is equal to a sound wave arrival time from the fourth substrate opening to the diaphragm.
9. The microphone unit according to claim 1 , further comprising a wiring board having a first through hole and a second through hole,
wherein the wiring board is disposed at a position at which the first through hole is communicated with the first substrate internal space via the second substrate opening, and the second through hole is communicated with the second substrate internal space and the cover portion internal space via the fourth substrate opening.
10. The microphone unit according to claim 9 , wherein:
an area surrounding the first through hole on one surface of the wiring board and an area surrounding the second opening on the other surface of the microphone substrate are connected so as to face each other, and
an area surrounding the second through hole on one surface of the wiring board and an area surrounding the fourth opening portion on the other surface of the microphone substrate are connected so as to face each other.