IP Library Granted Patent US 8,148,453
Granted Patent B2
US 8,148,453 · App. 12/869,080 · Granted Apr 3, 2012

Resin composition and molded product

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Quick Facts
Patent No.
US 8,148,453
App. No.
12/869,080
Granted
Apr 3, 2012
Kind
B2
Abstract

A resin composition containing at least (A) a polylactic acid, (B) a phosphazene compound, and (C) a rubber and/or thermoplastic elastomer.

Claims (33)

1. A resin composition comprising (A) a resin; (B) a phosphazene compound; and (C) a rubber,

wherein (A) the resin consists of a polylactic acid, and

when the resin composition is molded into a specimen, and a UL-V test is conducted according to a testing method of UL-94 (1.6 mm thickness) using the specimen, the result is V-2 or superior.

2. The resin composition according to claim 1 ,

wherein (B) the phosphazene compound contains one selected from the group consisting of a cyclic phenoxy phosphazene, a linear phenoxy phosphazene and a phenoxy phosphazene.

3. The resin composition according to claim 1 ,

wherein the content of (B) the phosphazene compound in the resin composition is 5 parts or more and 100 parts or less based on 100 parts of the polylactic acid.

4. The resin composition according to claim 1 ,

wherein (C) the rubber contains one selected from the group consisting of a silicone-acryl blend rubber, an acryl rubber, a butadiene rubber and a natural rubber.

5. The resin composition according to claim 1 ,

wherein the content of (C) the rubber in the resin composition is 0.1 parts or more and 20 parts or less based on 100 parts of the polylactic acid.

6. The resin composition according to claim 1 , further comprising a polyfunctional compound.

7. The resin composition according to claim 6 ,

wherein the polyfunctional compound contains one selected from the group consisting of a carbodiimide compound, a dicarboxylic acid compound, a diol compound, a hydroxyl carboxylic acid compound and an epoxy compound.

8. The resin composition according to claim 6 ,

wherein the content of the polyfunctional compound in the resin composition is 0.1 parts or more and 10 parts or less based on 100 parts of the polylactic acid.

9. A resin molded product comprising a resin composition comprising (A) a resin, (B) a phosphazene compound, and (C) a rubber,

wherein (A) the resin consists of a polylactic acid, and

when the resin composition is molded into a specimen, and a UL-V test is conducted according to a testing method of UL-94 (1.6 mm thickness) using the specimen, the result is V-2 or superior.

10. The resin molded product according to claim 9 ,

wherein (B) the phosphazene compound contains one selected from the group consisting of a cyclic phenoxy phosphazene, a linear phenoxy phosphazene and a phenoxy phosphazene.

11. The resin molded product according to claim 9 ,

wherein the content of (B) the phosphazene compound in the resin composition is 5 parts or more and 100 parts or less based on 100 parts of the polylactic acid.

12. The resin molded product according to claim 9 ,

wherein (C) the rubber contains one selected from the group consisting of a silicone-acryl blend rubber, an acryl rubber, a butadiene rubber and a natural rubber.

13. The resin molded product according to claim 9 ,

wherein the content of (C) the rubber in the resin composition is 0.1 parts or more and 20 parts or less based on 100 parts of the polylactic acid.

14. The resin molded product according to claim 9 , further comprising a polyfunctional compound.

15. The resin molded product according to claim 14 ,

wherein the polyfunctional compound contains one selected from the group consisting of a carbodiimide compound, a dicarboxylic acid compound, a diol compound, a hydroxyl carboxylic acid compound and an epoxy compound.

16. The resin molded product according to claim 14 ,

wherein the content of the polyfunctional compound in the resin composition is 0.1 parts or more and 10 parts or less based on 100 parts of the polylactic acid.

17. The resin molded product according to claim 14 which is a component of electronic and electric equipments.

Assignments (1)
CHANGE OF NAME Recorded Aug 12, 2021
From: FUJI XEROX CO., LTD.
To: FUJIFILM BUSINESS INNOVATION CORP.
Reel/Frame 058287/0056 →