IP Library Granted Patent US 8,248,795
Granted Patent B2
US 8,248,795 · App. 12/871,852 · Granted Aug 21, 2012

Data center and server module of the same

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Quick Facts
Patent No.
US 8,248,795
App. No.
12/871,852
Granted
Aug 21, 2012
Kind
B2
Abstract

A data center includes a server module. The server module includes a housing, and a number of heat-generating elements arranged in the housing. The housing includes a front wall, a back wall, and left and right sidewalls. When the server module runs, cool air comes into the housing through the front wall and the back wall, for cooling the heat elements, then the heated air in the housing is vented out of the housing through the left and right sidewalls by a number of fans.

Claims (11)

1. A data center comprising:

a server module comprising a housing, and a plurality of heat-generating elements arranged in the housing;

wherein the housing comprises a front wall, a back wall, and left and right sidewalls, the front wall and the back wall define a plurality of through holes, the left and right sidewalls define a plurality of vents, a plurality of fans is arranged in the housing adjacent to and aligning with the vents; and

wherein when the server module runs, air comes into the housing through the through holes of the front wall and the back wall for cooling the heat elements, then the air in the housing is vented out of the housing through the vents of the left and right sidewalls by the fans.

2. The data center of claim 1 , wherein a plurality of temperature sensing elements are arranged in the housing adjacent to the fans, for sensing the temperature of the airflow near the fans.

3. A server module comprising:

a housing comprising a front wall, a back wall, and left and right walls connected between the front wall and the back wall, the front wall and the back wall defining a plurality of through holes, the left and right sidewalls defining a plurality of vents;

a plurality of heat-generating elements arranged in the housing; and

a plurality of fans arranged in the housing, adjacent to and aligning with the vents;

wherein when the server module runs, air comes into the housing through the through holes of the front wall and the back wall for cooling the heat elements, then the air in the housing is vented out of the housing through the vents of the left and right sidewalls by the fans.

4. The server module of claim 3 , further comprising a plurality of temperature sensing elements arranged in the housing adjacent to the fans, for sensing the temperature of the airflow near the fans.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2018
From: HON HAI PRECISION INDUSTRY CO., LTD.
To: CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 045281/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2010
From: CHANG, YAO-TING
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 024912/0158 →