IP Library Granted Patent US 8,599,572
Granted Patent B2
US 8,599,572 · App. 12/873,953 · Granted Dec 3, 2013

Printed circuit board with integrated thin film battery

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Quick Facts
Patent No.
US 8,599,572
App. No.
12/873,953
Granted
Dec 3, 2013
Kind
B2
Abstract

The present invention relates to, for example, printed circuit boards having a thin film battery or other electrochemical cell between or within its layer or layers. The present invention also relates to, for example, electrochemical cells within a layer stack of a printed circuit board.

Claims (25)

1. A printed circuit board comprising:

a layer stack having two electrically insulating layers comprising conductor traces,

wherein each of said electrically insulating layers having outside edges that comprises a perimeter; and

an electrochemical cell inserted between said electrically insulating layers, the electrochemical cell having a top layer and a bottom layer,

wherein the top layer and the bottom layer of said electrochemical cell extend laterally beyond the perimeter of one of said insulating layers.

2. The printed circuit board of claim 1 , wherein the top layer and the bottom layer are two terminals and said electrochemical cell extends laterally beyond the perimeter of one of said electrically insulating layers to provide direct and external electrical access to one of said terminals.

3. The printed circuit board of claim 1 , further comprising an electrical contact in electrical connection with said electrochemical cell, said electrical contact being externally accessible through an access port.

4. The printed circuit board of claim 3 wherein said electrochemical cell comprises a terminal and wherein said electrical contact electrically connects with said terminal and said terminal is not externally accessible through said access port.

5. The printed circuit board of claim 4 further comprising conductor material within said access port and further comprising a cap of insulating material over said access port.

6. The printed circuit board of claim 1 wherein said electrochemical cell is approximately the same thickness as the combination of two of said electrically insulating layers.

7. The printed circuit board of claim 1 wherein said electrochemical cell is thicker than the combination of two of said electrically insulating layers.

8. The printed circuit board of claim 1 wherein said electrochemical cell is thinner than the combination of two of said electrically insulating layers.

9. The printed circuit board of claim 1 wherein said electrochemical cell is thicker than at least one of said insulating layers.

10. The printed circuit board of claim 1 wherein said electrochemical cell is thinner than at least one of said insulating layers.

11. The printed circuit board of claim 1 wherein said electrochemical cell is about the same thickness as at least one of said insulating layers.

12. A printed circuit board comprising: two insulating layers with at least one electrically insulating layer comprising conductor traces;

an interior defined directly between the two insulating layers;

an electrochemical cell located within the interior of said electrically insulating layers; and

a space located at an edge of said electrochemical cell in the interior, the space defined between said electrochemical cell and the electrically insulating layers.

13. The printed circuit board of claim 12 wherein said electrochemical cell extends laterally beyond the perimeter of said electrically insulating layer.

14. The printed circuit board of claim 12 , further comprising an electrically conducting layer wherein said electrochemical cell is embedded between said electrically conducting layer and said electrically insulating layer.

15. The printed circuit board of claim 12 , further comprising an electrically conducting layer wherein said electrically conducting layer is embedded between said electrochemical cell and said electrically insulating layer.

16. The printed circuit board of claim 12 , further comprising two electrically conducting layers wherein said electrochemical cell is embedded between said electrically conducting layers.

17. The printed circuit board of claim 12 , further comprising two electrically conducting layers.

18. The printed circuit board of claim 12 , further comprising electrical contact in electrical connection with said electrochemical cell, said electrical contact being externally accessible.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2014
From: FEENEX, INC.
To: SAPURAST RESEARCH LLC
Reel/Frame 034298/0730 →
CHANGE OF NAME Recorded Nov 7, 2014
From: INFINITE POWER SOLUTIONS, INC.
To: FEENEX, INC.
Reel/Frame 034192/0790 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2010
From: NEUDECKER, BERND J.; KEATING, JOSEPH A.
To: INFINITE POWER SOLUTIONS, INC.
Reel/Frame 024925/0693 →