Semiconductor device
View Patent ↗The present invention proposes a dummy metal fill structure which makes it possible to reduce variations in transistor characteristics as much as possible even if mask misalignment occurs, as well as to ensure the intended planarizing effect of the metal CMP process. The dummy metal fill formed above the gate electrode extends in the gate length direction with both ends thereof protruding from a region corresponding to the gate electrode. Even if a mask for forming a wiring layer is misaligned and the position of the dummy metal fill is misaligned from an intended position, the shape of the dummy metal fill within a region of the gate electrode is kept symmetric with respect to the center of the gate electrode.
1. A semiconductor device comprising:
a semiconductor substrate;
a MOS transistor formed on the semiconductor substrate including first and second main electrode regions as a source and a drain and a gate electrode for controlling a current flowing between the source and the drain; and
a dummy metal fill which is stacked above a channel region of the MOS transistor and includes a plurality of dummy metal segments, each of said plurality of dummy metal segments being separate from one another, wherein
the plurality of dummy metal segments of the dummy metal fill are separated in point symmetry with respect to a geometrical center of the channel region.
2. The semiconductor device of claim 1 , wherein a geometrical center of one of the dummy metal segments coincides with the geometrical center of the channel region and the other dummy metal segments are arranged in point symmetry with respect to the geometrical center of the channel region.
3. The semiconductor device of claim 1 , wherein a midpoint of a line connecting geometrical centers of two of the dummy metal segments coincides with the geometrical center of the channel region and the other dummy metal segments are arranged in point symmetry with respect to the geometrical center of the channel region.
4. The semiconductor device of claim 1 , wherein the dummy metal segments have the same dimension.
5. The semiconductor device of claim 1 , wherein each of the dummy metal segments has a square shape.
6. The semiconductor device of claim 1 , wherein each of the dummy metal segments has a rectangular shape.
7. The semiconductor device of claim 1 , wherein each of the dummy metal segments has a round shape.
8. The semiconductor device of claim 1 , wherein each of the dummy metal segments has a square shape with rounded corners.
9. The semiconductor device of claim 1 , wherein the dummy metal fill is formed on a top surface of an interlayer insulating film covering the MOS transistor.
10. The semiconductor device of claim 1 , wherein the dummy metal fill is buried in a groove formed in a top surface of an interlayer insulating film covering the MOS transistor.
11. The semiconductor device of claim 1 , wherein the dummy metal fill is formed in an interlayer insulating film covering the MOS transistor with a barrier metal interposed therebetween.
12. The semiconductor device of claim 1 , wherein the MOS transistor is a transistor used to provide a differential pair or a current mirror pair in an analog circuit.