Filler panel for air flow management
A filler panel for an electronics shelf is provided. The electronics shelf includes a plurality of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a back wall, a top wall, a bottom wall and a single side wall. The front wall, back wall, top wall and bottom wall are configured to fill a width of a slot of the electronics shelf. The side wall is configured to extend into a depth of the slot, The filler panel also includes an electromagnetic shielding portion comprising a conductive material that is coupled to the main body. The main body further includes one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body.
1. A filler panel for an electronics shelf, the electronics shelf comprising a plurality of slots each configured to receive an electronic device, the filler panel comprising:
a non-conductive main body, the main body comprising a front wall, a back wall, a top wall, a bottom wall and a single side wall, the front wall, back wall, top wall and bottom wall configured to fill a width of a slot of the electronics shelf and the side wall configured to extend into a depth of the slot when the slot does not contain an electronic device; and
an electromagnetic shielding portion comprising a conductive material and coupled to the main body;
the main body further comprising one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body.
2. The filler panel of claim 1 , wherein the main body comprises a non-conductive plastic.
3. The filler panel of claim 1 , wherein the conductive material comprises a conductive plastic.
4. The filler panel of claim 1 , wherein the conductive material comprises a metal.
5. The filler panel of claim 1 , wherein the electromagnetic shielding portion is coupled to the back wall of the main body.
6. A method for installing a filler panel in an electronics shelf, the electronics shelf comprising a plurality of slots each configured to receive an electronic device, the method comprising:
inserting a filler panel in a slot of the electronics shelf that does not contain an electronic device, the filler panel comprising:
a non-conductive main body, the main body comprising a front wall, a back wall, a top wall, a bottom wall and a single side wall, the front wall, back wall, top wall and bottom wall configured to fill a width of a slot of the electronics shelf and the side wall configured to extend into a depth of the slot; and
an electromagnetic shielding portion comprising a conductive material and coupled to the main body;
the main body further comprising one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body; and
wherein the filler panel is inserted next to one of: a) a wall of the electronics shelf, b) an electronic device positioned in an adjacent slot of the electronics shelf, or c) a second filler panel positioned in an adjacent slot of the electronics shelf, where the side wall of the filler panel and the wall of the electronics shelf, the electronic device, or the second filler panel form an air flow channel between the vents.
7. The method of claim 6 , wherein the main body comprises a non-conductive plastic.
8. The method of claim 6 , wherein the conductive material comprises a conductive plastic.
9. The method of claim 6 , wherein the conductive material comprises a metal.
10. The method of claim 6 , wherein the electromagnetic shielding portion is coupled to the back wall of the main body.