Method for realizing a dual interface IC card
A method for realizing a dual interface IC card includes arranging a plastic support having a hole or a recess for housing a micro module, and housing in the IC card an antenna having at least one first and one second terminal or pad for connection to the micro module arranged in the recess. The method also includes distributing a soldering paste on the at least one first and one second pad, so as to form a first and a second contact conductive bump with electric connection contacts of the micro module, and distributing, along the whole perimeter of the micro module or of the recess, a layer of non conductive glue. The method further includes positioning the micro module in the recess with the contacts axially aligned to the terminal of the antenna, and executing a reflow of the soldering paste to form the first and second conductive bump.
1. A method of making a dual interface IC card comprising:
forming a plastic support having a recess defined therein for receiving a micro-module;
placing solder paste on first and second conductive pads of the micro-module so as to form first and second solder paste bumps thereon;
placing non-conductive glue along a perimeter of the recess;
positioning the micro-module in the recess with the first and second conductive pads aligned with first and second terminals of an antenna; and
reflowing the first and second solder paste bumps to form first and second conductive bumps coupling the first and second conductive pads of the micro-module to the first and second terminals of the antenna.
2. A method according to claim 1 , wherein the solder paste comprises a conductive eutectic alloy of bismuth and tin.
3. A method according to claim 2 , wherein the conductive eutectic alloy comprises, by weight percentage, 58% bismuth and 42% tin.
4. A method according to claim 1 , wherein reflowing the first and second solder paste bumps comprises heating the first and second solder paste bumps to a melting point thereof using electromagnetic induction.
5. A method according to claim 4 , wherein the electromagnetic induction is realized by a solenoid positioned adjacent the dual interface IC card.
6. A method according to claim 1 , wherein the solder paste is placed on the first and second conductive pads by one of printing using a stencil, screening and dispensing, pin transfer, or jet printing.
7. A method of making a dual interface IC card comprising:
forming a plastic support having a recess defined therein for receiving a micro-module;
placing solder paste on first and second conductive pads of the micro-module so as to form first and second solder paste bumps thereon;
placing non-conductive glue along a perimeter of the micro-module;
positioning the micro-module in the recess with the first and second conductive pads aligned with first and second terminals of an antenna; and
reflowing the first and second solder paste bumps to form first and second conductive bumps coupling the first and second conductive pads of the micro-module to the first and second terminals of the antenna.
8. A method according to claim 7 , wherein the solder paste comprises a conductive eutectic alloy of bismuth and tin.
9. A method according to claim 8 , wherein the conductive eutectic alloy comprises, by weight percentage, 58% bismuth and 42% tin.
10. A method according to claim 7 , wherein reflowing the first and second solder paste bumps comprises heating the first and second solder paste bumps to a melting point thereof using electromagnetic induction.
11. A method according to claim 10 , wherein the electromagnetic induction is realized by a solenoid positioned adjacent the dual interface IC card.
12. A method according to claim 7 , wherein the solder paste is placed on the first and second conductive pads by one of printing using a stencil, screening and dispensing, pin transfer, or jet printing.
13. A method of making a dual interface IC card comprising:
forming a support having a recess defined therein for receiving a micro-module;
placing solder on first and second conductive pads of the micro-module so as to form first and second solder bumps thereon;
positioning the micro-module in the recess and attaching the micro-module to a perimeter of the recess, with the first and second conductive pads aligned with first and second terminals of an antenna; and
reflowing the first and second solder bumps to form first and second conductive bumps coupling the first and second conductive pads of the micro-module to the first and second terminals of the antenna.
14. A method according to claim 13 , wherein the solder comprises a conductive eutectic alloy of bismuth and tin.
15. A method according to claim 14 , wherein the conductive eutectic alloy comprises, by weight percentage, 58% bismuth and 42% tin.
16. A method according to claim claim 13 , wherein reflowing the first and second solder bumps comprises heating the first and second solder bumps to a melting point thereof using electromagnetic induction.
17. A dual interface IC card comprising:
a plastic support having a recess defined therein;
a micro-module positioned in the recess and attached to a perimeter of the recess, and having first and second conductive pads;
an antenna having first and second terminals; and
first and second conductive bumps coupling the first and second conductive pads to the first and second terminals.
18. A dual interface IC card according to claim 17 , wherein the first and second conductive bumps comprise a conductive eutectic alloy of bismuth and tin.
19. A dual interface IC card according to claim 18 , wherein the micro-module is attached to the perimeter of the recess by a non-conductive glue.