IP Library Granted Patent US 8,417,861
Granted Patent B2
US 8,417,861 · App. 12/877,736 · Granted Apr 9, 2013

Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments

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Quick Facts
Patent No.
US 8,417,861
App. No.
12/877,736
Granted
Apr 9, 2013
Kind
B2
Abstract

Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly.

Claims (27)

1. A data center, comprising:

a plurality of data units located in a computer server of the data center, including a first plurality of wireless-enabled components (WECs) located in respective ones of the data units; and

a backplane unit located in the computer server, including a second plurality of WECs located in the backplane unit;

wherein the first plurality of WECs and the second plurality of WECs are wirelessly coupled via one or more wireless links, thereby creating a wireless bus system within the data center.

2. The data center of claim 1 , wherein communication between a first WEC and a second WEC both located in a first data unit of the plurality of data units is performed wirelessly.

3. The data center of claim 1 , wherein communication between a first WEC located in a first data unit of the plurality of data units and a second WEC located in a second data unit of the plurality of data units is performed wirelessly.

4. The data center of claim 1 , wherein communication between a first WEC located in a first data unit of the plurality of data units and a second WEC located in the backplane unit is performed wirelessly.

5. The data center of claim 1 , wherein a first WEC of the first or second plurality of WECs, comprises:

a core module that performs one or more functions of the first WEC;

a wireless transceiver, coupled via an interface to the core module, that allows the core module to communicate wirelessly over the wireless bus; and

a power interface that receives power from an external source and that provides power to the core module and the wireless transceiver.

6. The data center of claim 5 , wherein the power interface includes a wireless power interface that receives power wirelessly from the external source.

7. The data center of claim 5 , wherein the core module includes one or more blocks of an integrated circuit (IC).

8. The data center of claim 5 , wherein the core module includes a single integrated circuit (IC).

9. The data center of claim 5 , wherein the core module includes a plurality of integrated circuits (ICs).

10. The data center of claim 5 , wherein the first WEC further comprises:

a wireless antenna, coupled to the wireless transceiver.

11. The data center of claim 10 , wherein the wireless antenna is steered using MEMS.

12. The data center of claim 1 , wherein the wireless links include at least one of RF, optical, and proximity coupling links.

13. The data center of claim 1 , wherein the wireless links are adapted according to a polarization diversity scheme.

14. The data center of claim 1 , wherein the wireless links are adapted according to a pattern diversity scheme.

15. The data center of claim 1 , wherein the wireless links are adapted according to a spatial diversity scheme.

16. The data center of claim 1 , wherein at least one of the wireless links is established using beamforming.

17. The data center of claim 1 , wherein at least one of the wireless links is established using directional transmission.

18. The data center of claim 1 , wherein the wireless links are dynamically adaptable according to one or more of activity level, power consumption, communication delay, and interference over the wireless bus system.

19. The data center of claim 1 , wherein the wireless links and routes created by said wireless links are dynamically adaptable according to one or more of the relative position of the WECs, available capabilities at the WECs, availability of resources at the WECs, and the physical environment of the wireless bus system.

20. The data center of claim 1 , wherein the data center is wire-free.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09/05/2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0456 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0133 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2010
From: ROFOUGARAN, AHMADREZA (REZA); BEHZAD, ARYA REZA; ZHAO, SAM ZIQUN; CASTANEDA, JESUS ALFONSO; BOERS, MICHAEL
To: BROADCOM CORPORATION
Reel/Frame 024956/0367 →