IP Library Granted Patent US 8,940,210
Granted Patent B2
US 8,940,210 · App. 12/878,482 · Granted Jan 27, 2015

Methods for manufacturing three-dimensional devices and devices created thereby

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Quick Facts
Patent No.
US 8,940,210
App. No.
12/878,482
Granted
Jan 27, 2015
Kind
B2
Abstract

In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Claims (42)

1. A method, comprising:

demolding a silicone first cast product from a mold without damage to either the first cast product or the mold, the mold comprising a stacked plurality of micro-machined metallic foil layers that define a protruding undercut and a feature, the first cast product reflecting the protruding undercut and the feature, the protruding undercut aligned substantially perpendicularly to a direction in which the first cast product is removable from the mold without damage to the first cast product and without damage to the mold,

wherein:

contact between the protruding undercut and a surface of the first cast product is released via a force applied in the direction;

the surface is spatially reflective of the protruding undercut and located within a plane that is perpendicular to the direction; and

a thickness of each micro-machined metallic foil layer of the mold from the plurality of micro-machined metallic foil layers is between 2 micrometers and 100 micrometers.

2. The method of claim 1 , wherein:

the feature is an isotropic wall.

3. The method of claim 1 , wherein:

the feature is a sub-cavity.

4. The method of claim 1 , wherein:

the feature is a sub-cavity in fluid communication with an outer edge of a layer of the mold.

5. The method of claim 1 , wherein:

the micro-machined layers are lithographically-derived.

6. The method of claim 1 , wherein:

the micro-machined layers are non-lithographically-derived.

7. The method of claim 1 , wherein:

the micro-machined layers are formed via laser machining.

8. The method of claim 1 , wherein:

the micro-machined layers are formed via ion etching.

9. The method of claim 1 , wherein:

the micro-machined layers are formed via electroplating.

10. The method of claim 1 , wherein:

the micro-machined layers are formed via vapor deposition.

11. The method of claim 1 , wherein:

the micro-machined layers are formed via bulk micro-machining.

12. The method of claim 1 , wherein:

the micro-machined layers are formed via surface micro-machining.

13. The method of claim 1 , wherein:

the micro-machined layers are formed via conventional machining.

14. The method of claim 1 , wherein:

the mold is reusable.

15. The method of claim 1 , wherein:

the feature is an attachment feature adapted to attach said first cast product to a distinct part.

16. The method of claim 1 , wherein:

the feature is an anisotropic wall.

17. The method of claim 1 , wherein:

the feature is a non-planar wall.

18. The method of claim 1 , wherein:

the feature has a substantially triangular cross-section.

19. The method of claim 1 , wherein:

the feature has a substantially rectangular cross-section.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE AND REMOVE PATENT APPLICATION NUMBER 11886281 AND ADD PATENT APPLICATION NUMBER 14846874. TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 054062 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF ADDRESS. Recorded Mar 4, 2021
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 055659/0001 →
CHANGE OF NAME Recorded Sep 4, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 054062/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2018
From: MIKRO SYSTEMS, INC.
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 046232/0716 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2017
From: APPLEBY, MICHAEL P.; FRASER, IAIN; ATKINSON, JAMES E.
To: MIKRO SYSTEMS, INC.
Reel/Frame 043063/0809 →